Browsing by Author "Wang, Chih-Lun"

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Study on Low Temperature Cu Bonding and Temporary Bond/De-Bond for RDL-First Fan-Out Panel Level Package
(2017-01-01)
Ko, Cheng-Ta
;
Yang, Kai-Ming
;
Lin, Jim-Wein
;
Wang, Chih-Lun
;
Chou, Tzu-Chieh
In this study, Cu-Cu bonding with pillar-concave structure on a polymer layer was investigated to realize better bonding quality at lower temperature, while a low-stress release layer for temporary bond and de-bond by laser ablation was demonstrated to handle a glass panel for re-distribution layer (RDL) process. The low temperature technology can be potentially applied for RDL-first fan-out panel level package (FOPLP).