Browsing by Author "Wang, YY"

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A new dual-band antenna for WLAN applications
(2004)
Wang, YY
;
Chung, SJ
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電信工程研究所
;
Institute of Communications Engineering
An efficient dual-interpolator architecture for subpixel motion estimation
(2005)
Wang, YY
;
Tsai, CJ
;
資訊工程學系
;
Department of Computer Science
New generation of video codecs typically adopts a sophisticated interpolation filter for sub-pixel motion estimation (ME). For embedded applications, it is crucial to reduce both the memory requirement and the computational complexity for sub-pixel ME. The key observation in this paper is that the interpolation filter for motion estimation and the filter for coding do not have to be the same. By adopting a simpler on-the-fly interpolation filter during ME process and a standard-compliant filter for coding purpose, both memory and complexity can be reduced with very little coding performance degradation. Since Hadamard transformed-SAD is often used in high quality codecs as a better matching measure, we further show that the ME interpolation Mer can be combined with Hadamard transform for efficient VLSI implementation. Initial results show very promising performance of the proposed system.
CoTiO3 high-kappa, dielectrics on HSG for DRAM applications
(2004-12-01)
Chao, TS
;
Ku, WM
;
Lin, HC
;
Landheer, D
;
Wang, YY
In this paper, a new high-kappa dielectric CoTiO3 has been investigated for the first time on hemispherical grained (HSG) poly-Si dynamic random access memories capacitors. Three types of HSG were prepared. We found that capacitors with maximum grain size and the highest density exhibit twice the capacitance of the others. The dielectric constant for CoTiO3 was estimated to be larger than 50. Leakage current measurements performed at temperatures as high as 100degreesC show that this dielectric is stable. The polarity dependence is found to be due to the different barrier heights with the nitride barrier. A leakage mechanism is proposed for this polarity dependence.
Mechanism for Cu void defect on various electroplated film conditions
(2006-03-01)
Feng, HP
;
Cheng, MY
;
Wang, YL
;
Chang, SC
;
Wang, YY
This study observes that copper (Cu) films deposited by high current densities or in an aged electrolyte easily generate void defects after chemical mechanical polishing (CMP). The (111)/(200) ratio and the impurity amount of an electroplated Cu film are found to have strong correlation with the formation of void defects. Furthermore, pulse-reverse waveform plating following direct current plating is used for the deposition of partial Cu films that will be exposed after Cu CMP. This new scheme produces a void-less Cu surface after CMP. (c) 2005 Elsevier B.V. All rights reserved.
Preparation and properties of polyacrylate/clay photocured nanocomposite materials
(2005-06-28)
Wang, YY
;
Hsieh, TE
;
材料科學與工程學系
;
Department of Materials Science and Engineering
A functionalized surfactant, GME-N-C-10 containing a C=C double bond, was synthesized to modify clays such as montmorillonite (MMT) and mica for the preparation of organic-inorganic composite resins via radical photoinduced polymerization. As revealed by X-ray diffraction (XRD) analysis of the organophilic samples, the synthesized surfactant was successfully intercalated into the layers of clay by its full molecular length and such an intercalation generated a paraffin-like structure in the modified clays. By forming the C-C bonds between surfactants and oligomers/monomers during subsequent radical photoinduced polymerization, the hybrid comprising organophilic clay/oligomers/monomers became an intercalated nanocomposite resin. The thickness of the dispersed lamellae was less than 100 nm, as revealed by transmission electron microscopy (TEM). For the composite sample containing 5.0 wt.% of organophilic clay, the decomposition temperatures raised at least 15 degrees C; the transmittance detected by UV-visible spectrometer showed a less than 15% loss in the visible light region but a satisfactory transparency was still retained, and the degree of moisture absorption decreased from 3.4% to about 1% due to dispersive organophilic clay in the polymer matrix.
VLSI architecture design of motion estimator and in-loop filter for MPEG-4 AVC/H.264 encoders
(2004)
Wang, YY
;
Peng, YT
;
Tsai, CJ
;
資訊工程學系
;
Department of Computer Science
In this paper, a new complexity-reduced method and its hardware architecture for motion estimation and the in-loop filter for MPEG-4 AVC/H.264 is proposed. The feature of the proposed method is focused on the computation reduction for the motion search algorithm among multiple reference frames and the mode partition determination. Furthermore, to verify the functionality and performance of the proposed hardware design, an emulation board platform, the ARM Integrator, is used for H.264 hardware/software co-development. The experimental results show that the proposed method has excellent performance with little or no degradation of coding efficiency.