Browsing by Author "Weng, JH"

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Development of IPv6-IPv4 translation mechanisms for SIP-based VoIP applications
(2005)
Chen, WE
;
Su, CY
;
Weng, JH
;
資訊工程學系
;
Department of Computer Science
This paper presents the development and deployment of two IPv6-IPv4 translation mechanisms (i.e., Socket-layer Translator and SIPv6 Translator) for SIP VoEP applications in Taiwan. The Socket-layer Translator embeds in the TCP(UDP)/IPv4 TSP and translates the IPv4 Winsock function calls to IPv6. The SIPv6 Translator is a translation gateway between IPv6 and IPv4 networks and assists the IPv6 SIP User Agents to communicate with the IPv4 SIP User Agents. These two translation mechanisms can accelerate the IPv6 transition. This deployment project is sponsored by NICI EPv6 R&D Division. The results of this paper can be shared with the person who attempts to deploy an EPv6-based SIP VoIP environment.
Structural design and analysis of micromachined ring-type vibrating sensor of both yaw rate and linear acceleration
(2005-01-14)
Weng, JH
;
Chieng, WH
;
Lai, JM
;
機械工程學系
;
Department of Mechanical Engineering
This work presents the design and analysis of a micromachined ring-type motion sensor which can sense both the yaw rate and linear acceleration of a device in that it is installed. It integrates the functions of a gyroscope and an accelerometer. The design of the microstructure is based on the structure of a vibrating ring gyroscope. The analysis, considering the symmetry of the structure, implies that the rotational symmetry and mirror symmetry of the microstructure markedly affect the performance of the sensor. The modes of vibration determined using finite element analysis and the theoretical calculation of the resonant frequency of the structure are presented. The sensitivities of the characteristic of the sensor to the design specification, the fabrication errors and the theoretical errors are discussed. The structure is fabricated based on deep silicon etching and wafer bonding techniques. The process is developed for eliminating the aspect ratio dependent effect (ARDE) in dry etching process. (C) 2004 Elsevier B.V. All rights reserved.
Structural fabrication of a ring-type motion sensor
(2004-05-01)
Weng, JH
;
Chieng, WH
;
Lai, JM
;
機械工程學系
;
Department of Mechanical Engineering
The structural fabrication of a ring-type motion sensor is described. This micromachined ring-type sensor can be used to detect both yaw rate and linear acceleration. The fabrication is based on deep silicon etching and wafer bonding. An aspect ratio dependent effect (ARDE) always occurs in the dry etching process for a micro electromechanical systems (MEMS) device. Additionally, three processes are developed and modified progressively for eliminating ARDE from the fabrication results. Results indicate that the proposed process provides more flexibility than other processes with respect to the structural fabrication of a MEMS device. The sensitivity of the sensor characteristic to the manufacturing errors is considered as well.