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Browsing by Author "Wu, John"

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    Low temperature Au-Au direct bonding with highly < 111 >-oriented Au films
    (2019-01-01)
    Hsu, Wei-You
    ;
    Wu, John
    ;
    Chen, Chih
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    材料科學與工程學系
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    Department of Materials Science and Engineering
    In this study, a bonding process with highly < 111 > oriented nano-twined Au (nt-Au) was proposed. A less void bonding interface was observed and it reveals a good bonding quality for the bonded samples. In addition, the Au grains can grow across original interface. All of the above make we suggest Au-Au direct bonding have high strength and durable bonding structure.