Browsing by Author "Wu, Qi"

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An RDL-First Fan-out Wafer-level Package for Heterogeneous Integration Applications
(2018-01-01)
Lin, Yu-Min
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Wu, Sheng-Tsai
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Shen, Wen-Wei
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Huang, Shin-Yi
;
Kuo, Tzu-Ying
Fan-out wafer-level packaging (FOWLP), a new heterogeneous integration technology, is gradually becoming an attractive solution. Compared with conventional 2.5D/3D IC structures, fan-out WLP does not use a costly interposer element and can have a thin, high-density, and low-cost IC packaging. In this study, a novel fan-out WLP with RDL-first method is demonstrated. Finite element method was used to optimize the warpage control of a reconstituted wafer and to identify the material properties and fabrication for the FOWLP. Calculation results were applied in the design of the test vehicle. Reliability testing of each component level was performed with different techniques such as temperature cycling test (TCT), high temperature storage (HTS) and thermal humidity storage test (THST). The demonstration of RDL-first WLP technology without interposer proves that it has excellent potential for heterogeneous integration applications.
<bold>ROBUST PARKING SPACE DETECTION CONSIDERING INTER-SPACE CORRELATION</bold>
(2007)
Wu, Qi
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Huang, Chingchun
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Wang, Shih-yu
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Chiu, Wei-Chen
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Chen, Tsuhan
A major problem in metropolitan areas is searching for parking spaces. In this paper, we propose a novel method for parking space detection. Given input video captured by a camera, we can distinguish the empty spaces from the occupied spaces by using an 8-class Support Vector Machine (SVM) classifier with probabilistic outputs. Considering the inter-space correlation, the outputs of the SVM classifier are fused together using a Markov Random Field (MRF) framework. The result is much improved detection performance, even when there are significant occlusion and shadowing effects in the scene. Experimental results are given to show the robustness of the proposed approach.
Optimization of laser release process for throughput enhancement of fan-out wafer-level packaging
(2018-01-01)
Lee, Chia-Hsin
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Su, Jay
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Liu, Xiao
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Wu, Qi
;
Lin, Jim-Wein
Fan-out wafer-level-packaging (FOWLP) technology has been developed with various advantages, such as smaller form factor, lower cost, and simplified supply chain for heterogeneous integration. There have been several process schemes like chip-first or chip-last FOWLP integration discussed widely in conferences in recent years. One process in all of these process schemes has in common is the use of a temporary carrier for subsequent redistribution layer (RDL) formation, chip stacking and molding processes. Although the separation of a temporary carrier from the reconstituted wafer could be achieved without significant hurdles, there were few studies addressing optimization of carrier separation for throughput enhancement. Thus, this paper is designed to address the needs in optimizing carrier separation process based upon laser ablation technology. Two phases of experiments were designed to select the appropriate laser release layer and define optimal laser settings. The first experiment was used to evaluate correlation of the laser absorption, laser energy, and spot pitch versus completeness of laser ablation. The second experiment included RDL-first FOWLP integration. At first, 300-mm glass carriers (1000 mu m thick) with coefficient of thermal expansion of 8 ppm/degrees C were treated by selected laser release layers. After deposition of 0.05-mu m Ti/0.15 mu m Cu on the glass carrier, passivation of around 8 mu m was coated and patterned by lithography for electroplating Cu interconnections with a density of approximately 10% of the surface area. Subsequently, die bonding, build-up layers, or molding compound were applied on top to form a 200-mu m reconstituted wafer. The reconstituted wafer was then separated from the glass carrier through a laser ablation process using a 355-nm laser to determine optimal throughput. Experiments to study correlation of laser release layer with laser settings along with a demonstration of full RDL-first FOWLP integration are discussed thoroughly to address the need of throughput enhancement, which could serve as cornerstone for realizing cost-effective RDL-first FOWLP.