Browsing by Author "Wu, SA"

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Effect of deposition temperature, on thermal stability in high-density plasma chemical vapor deposition fluorine-doped silicon dioxide
(2004-05-01)
Cheng, YL
;
Wang, YL
;
Chen, HW
;
Lan, JL
;
Liu, CP
Thermal stability of fluorine-doped silicon dioxide films deposited by high-density plasma chemical vapor deposition as a function of deposition temperature were investigated in this study. Both thermal desorption spectrum and annealing test results show that SiOF films deposited above 400 degreesC have better thermal stability. Furnace annealing data indicate that non -Si-F- bonding fluorine does exist in low-deposition-temperature SiOF films. Furthermore, secondary-ion mass spectrometer results also reveal that the fluorine in SiOF films with a lower-deposition temperature is easily diffused out and turned into the underlayer, which results in less thermally stable SiOF films. Moreover, short-loop simulation results have been subsequently tested and it was concluded that the deposition temperature of the SiOF film is extremely important for thermal stability. (C) 2004 American Vacuum Society.
Optimization of post-N-2 treatment and undoped-Si-glass cap to improve metal wring delamination in deep submicron high-density plasma-fluorinated silica glass intermetal dielectric application
(2004-07-01)
Cheng, YL
;
Wang, YL
;
Lan, JK
;
Wu, SA
;
Chang, SC
Integration issues of metal line delamination from fluorinated silica glass (FSG) in deep submicron intermetal dielectric applications were investigated in this study. A metal line peeled off after a nonoptimized in situ deposition of undoped-silicon-glass (USG; SiO2) capping layer followed the post-FSG-chemical mechanical polishing N-2 treatment. It was found that higher bias power and longer process time of N-2 treatment led to more active fluorine species diffusing from the FSG films to the USG surface, which might react with subsequent Ti/TiN/W metal layer and result in metal delamination. Using plasma-enhanced N-2 treatment and ex situ USG capping with lower initial deposition temperature by extra cooling step, the stability of the FSG films was improved and resulted in a robust structure without metal peeling. (C) 2004 American Vacuum Society.