Browsing by Author "Wu, Song-Lin"

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High-Speed In0.52Al0.48As Based Avalanche Photodiode With Top-Illuminated Design for 100 Gb/s ER-4 System
(2018-12-01)
Wu, Song-Lin
;
Naseem
;
Wun, Jhih-Min
;
Chao, Rui-Lin
;
Huang, Jack Jia-Sheng
High-speed top-illuminated avalanche photodiodes (APDs) with large diameters (25 mu m) are demonstrated for the application of 4-channels 100 Gb/s data rate. They achieve a bandwidth of 17 GHz at low-gain (M-G = 6.2; 3.6 A/W) and large-gain bandwidth (responsivity bandwidth) product (410 GHz (237.8 GHz-A/W); 55% external efficiency at the unit gain) while maintaining invariant high speed (14 GHz) under high power (0.5 mW) and 0.9 V-b(r) operations. By packaging the demonstrated APD with a 25 Gb/s transimpedance amplifier in a 100 Gb/s ROSA package, a good sensitivity of around -20.6 dBm optical modulation amplitude (OMA) at the data rate of 25.78 Gb/s has been successfully demonstrated. The achieved sensitivity not only meets the required receiver sensitivity (-18.5 dBm OMA) in 100 GbE-ER-4 Lite (40 km) system, it is also comparable with that of the high-performance 1(N) Gb/s ROSA incorporated with the backside illuminated APD design. Overall, our novel APD structure can eliminate the costly flip-chip bonding package in the 100 Gb/s ROSA without sacrificing its sensitivity performance.
Top-Illuminated In0.52Al0.48As-Based Avalanche Photodiode With Dual Charge Layers for High-Speed and Low Dark Current Performances
(2018-03-01)
Chen, Yi-Han
;
Wun, Jhih-Min
;
Wu, Song-Lin
;
Chao, Rui-Lin
;
Huang, Jack Jia-Sheng
A novel type of top-illuminated, etch-mesa In0.52Al0.48 As-based avalanche photodiode (APD) with high-speed (>25 Gb/s), low dark current performance has been demonstrated. The 25G APD device is composed of n-side down design with the In0.52Al0.48As multiplication (M) layer buried at the bottom to avoid the issues of surface breakdown and complex guard ring structure. In addition, we demonstrate that the new structure with two charge layers and triple mesas can effectively confine the electric-field within the center of M-layer and minimize the edge breakdown around the periphery of mesa. In contrast to the costly flip-chip bonding package with backside illumination, our demonstrated device is based on a simple top-illuminated structure that includes a large active diameter of 30 mu m for easy optical alignment, a reasonable punch-through responsivity (0.7 A/W at 1.31 mu m wavelength), and a good 3-dB optical-to-electrical (O-E) bandwidth (22.5 GHz) under low gain operations (M-G = similar to 3). Furthermore, it can sustain the 3-dB bandwidth of 15 GHz over a wide range of launched optical power (-17 to + 4.6 dBm) under a moderate gain (M-G = similar to 5) operation at 1.31 mu m wavelength. High-sensitivity (-16 dBm) for error-free 28 Gb/s operation can also be achieved at 1.55 mu m wavelength.