<link rel="stylesheet" href="styles.cf390c6bfbe7555f.css">

Browsing by Author "Wu, Tsung-Heng"

Now showing 1 - 1 of 1
  • Thumbnail Image
    Item type:Item,
    NUMANA: A Hybrid Numerical and Analytical Thermal Simulator for 3-D ICs
    (2013-01-01)
    Lee, Yu-Min
    ;
    Wu, Tsung-Heng
    ;
    Huang, Pei-Yu
    ;
    Yang, Chi-Ping
    ;
    交大名義發表
    By combining analytical and numerical simulation techniques, this work develops a hybrid thermal simulator, NUMANA, which can effectively deal with complicated material structures, to estimate the temperature profile of a 3-D IC. Compared with a commercial tool, ANSYS, its maximum relative error is only 1.84%. Compared with a well known linear system solver, SuperLU [1], it can achieve orders of magnitude speedup.