Browsing by Author "Wu YewChung Sermon"

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Method of semiconductor manufacturing process
(2014-12-09)
Wu YewChung Sermon
;
Wang Bau-Ming
;
Hsiao Feng-Ching
The present invention related to a method for manufacturing a semiconductor, comprising steps of: providing a growing substrate; forming a semiconductor substrate on the growing substrate; forming a first structure with plural grooves and between the growing substrate and the semiconductor substrate; and changing the temperature of the growing substrate and the semiconductor substrate.
METHOD OF SEMICONDUCTOR MANUFACTURING PROCESS
(2012-09-13)
Wu YewChung Sermon
;
Wang Bau-Ming
;
Hsiao Feng-Ching
The present invention related to a method for manufacturing a semiconductor, comprising steps of: providing a growing substrate; forming a semiconductor substrate on the growing substrate; forming a first structure with plural grooves and between the growing substrate and the semiconductor substrate; and changing the temperature of the growing substrate and the semiconductor substrate.
METHOD OF SEMICONDUCTOR MANUFACTURING PROCESS
(2013-01-03)
Wu YewChung Sermon
;
Chen Yu-Chung
The present invention related to a method for manufacturing a semiconductor, comprising steps of: providing a growing substrate; forming on the growing substrate to have plural grooves; forming a semiconductor element layer on the growing substrate; and changing the temperature of the growing substrate and the semiconductor element layer so as to separate the semiconductor element layer from the growing substrate.
THERMAL DISSIPATION SUBSTRATE
(2012-11-01)
Wu YewChung Sermon
;
Chang Tai-Min
;
Chiu Yu Chia
;
Hu Jen-Li
The present invention related to a method for manufacturing a thermal dissipation substrate and a thermal dissipation substrate. The method includes steps of: (a) providing a substrate body having a surface; (b) forming a plurality of concave regions on the surface; and (c) filling the plurality of concave regions with a plurality of diamond materials. The thermal dissipation substrate includes: a substrate having a surface at a first horizontal; a plurality of regions formed on the surface at a second horizontal; and a plurality of diamond materials having a relatively high thermal coefficient and disposed on the plurality of regions.
Thermal dissipation substrate
(2014-08-05)
Wu YewChung Sermon
;
Chang Tai-Min
;
Chiu Yu Chia
;
Hu Jen-Li
The present invention related to a method for manufacturing a thermal dissipation substrate and a thermal dissipation substrate. The method includes steps of: (a) providing a substrate body having a surface; (b) forming a plurality of concave regions on the surface; and (c) filling the plurality of concave regions with a plurality of diamond materials. The thermal dissipation substrate includes: a substrate having a surface at a first horizontal; a plurality of regions formed on the surface at a second horizontal; and a plurality of diamond materials having a relatively high thermal coefficient and disposed on the plurality of regions.