Browsing by Author "Yang, Chia-Yeh"

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Nano-roughening for reliable N/MEMS manufacture
(2006)
Yang, Chia-Yeh
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Cheng, Y. T.
;
Hsu, W. S.
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電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
This paper presents a nano-roughneneing technique to effectively modify bonding surface for ensuring for the continuation of hermetic encapsulation shrinkage from MEMS to NEMS. The roughening is realized via a non-uniform etch characteristic of PR which is etched then utilized as an etching mask for the following silicon etching process. UV adhesive bonding is utilized for the verification of the nano-roughening for NEMS hermetic encapsulation. The average roughnesses of silicon substarte before and after the modification are 0.4nm and 12.4nm respectively. The roughness increase can effectively provide more than 30% bonding strength enhancement and 8% leakage reduction.
The Investigation of Nano-Roughening Effect on the Reliability Enhancement of Adhesive Bond for NEMS Manufacture Application
(2010-05-01)
Yang, Chia-Yeh
;
Cheng, Yu-Ting
;
Hsu, Wen-Syang
;
機械工程學系
;
電子工程學系及電子研究所
The paper shows the importance of nano-roughening on the bonding interface to the reliability enhancement of adhesive bond for ensuring the continuation of packaging shrinkage from MEMS to NEMS. The roughening is realized via a nonuniformly etching characteristic of PR which is etched and then utilized as an etching mask for following silicon etching process. Ultraviolet adhesive for silicon-to-glass bonding is utilized for the verification of the nano-roughening effect on NEMS hermetic encapsulation. The average roughnesses of the silicon substrate before and after roughening are 0.4 nm and 12.4 nm, respectively. Experimental results show that the roughness increase of silicon substrate can effectively provide more than 30% bonding strength enhancement and 30% leakage reduction. In addition, stamp-and-stick test shows that nano-roughening indeed provides a better adhesive characteristic that can further ensure the success of the stamp-and-stick process for nano/microfabrication.