Browsing by Author "Yang, Shao-Ming"
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Item type:Item, Cerium oxide nanocrystals for nonvolatile memory applications(2007-12-24) ;Yang, Shao-Ming ;Chien, Chao-Hsin ;Huang, Jiun-Jia ;Lei, Tan-FuTsai, Ming-JinnThe characteristics of silicon-oxide-nitride-oxide-silicon-type memories embedded with cerium oxide nanocrystals were demonstrated. They were fabricated by depositing a thin CeO(2) film on the SiO(2) tunneling layer and subsequently rapid-thermal annealing process. The mean size and aerial density of the CeO(2) nanocrystals embedded in SiO(2) are estimated to be about 8-10 nm and (3-7)x10(11)/cm(-2) after a high-temperature annealing with different ambients on 900 degrees C. The program/erase behaviors and data retention characteristics were described to demonstrate its advantages for nonvolatile memory device applications. (c) 2007 American Institute of Physics.Item type:Item, High charge storage characteristics of CeO2 nanocrystals for novolatile memory applications(2008) ;Yang, Shao-Ming ;Huang, Jiun-Jia ;Chien, Chao-Hsin ;Taeng, Pei-JerLee, Lurng-ShehngThis paper presents the formation of CeO2 nanocrystals on SiO2 tunneling layer and its annealing effect to the nonvolatile memory device. The characteristics including the program/erase behaviors, data retention, and endurance of Silicon-Oxide-Nitride-Oxide-Silicon type memories embedded with cerium oxide (CeO2) nanocrystals were studieded to demonstrate its advantages as a nonvolatile memory device.Item type:Item, Nanocrystallization and interfacial tension of sol-gel derived memory(2008-03-24) ;Wu, Chi-Chang ;Tsai, Yi-Jen ;Chu, Min-Ching ;Yang, Shao-MingKo, Fu-HsiangThe formation of the nanocrystals (NCs) by using the sol-gel spin-coating method at various annealing temperatures had been studied. The film started to form the islands at 600 degrees C annealing, and finally transferred into NCs at 900 degrees C. A model was proposed to explain the transformation of thin film. The morphology of sol-gel thin film at 600 degrees C annealing was varied and had higher interfacial energy. The crystallized process at 900 degrees C annealing could minimize the energy. The retention for 900 degrees C annealed sample exhibited less than 30% charge loss after 10(6) s at 125 degrees C measurement. (c) 2008 American Institute of Physics.Item type:Item, Nonvolatile flash memory devices using CeO2 nanocrystal trapping layer for two-bit per cell applications(2007-06-01) ;Yang, Shao-Ming ;Chien, Chao-Hsin ;Huang, Jiun-Jia ;Lei, Tan-Fu電子工程學系及電子研究所In this study, we demonstrated the characteristics of nonvolatile silicon oxide nitride oxide silicon (SONOS)-type memories using cerium oxide (CeO2) nanocrystals as a charge storage agent. We observed that the shape of the formed CeO2 nanocrystals is nearly spherical and that their size is almost similar identical to their high density of 5 x 101, cm(-2). Such CeO2 nanocrystals were formed by depositing a thin CeO2 film of ca. 2-3 nm thickness using an evaporater gun system and then rapid thermal annealing (RTA) in O-2 ambient at 900 degrees C for 1min. The fabricated memory devices show good electrical properties in terms of a sufficiently large memory window (>2 V), program/erase (P/E) speed (0.1/1 ms), retention time up to 10(4) S with only 5% charge loss, and endurance after 10(5) cycles with small memory window narrowing and two-bit operation. These properties suggest that the nonvolatile SONOS-type memories with the CeO2 nanocrystal trapping agent can be applied in future flash memories.Item type:Item, Reliability Analysis of Amorphous Silicon Thin-Film Transistors during Accelerated ESD Stress(2015) ;Tsai, Jung-Ruey ;Wen, Ting-Ting ;Yang, Shao-Ming ;Sheu, GeneChang, Ruey-DarThis work investigates the degradation of electrical characteristics of amorphous silicon thin-film transistors during the accelerated ESD stress with a 40V high voltage and a high/low current of 2 mA/0.1 mu A conditions. Both the leakage current and the threshold voltage shift are severe as the accelerated ESD stress applied at the gate region. The 40V accelerated ESD stress with a high current has more severe impact on the electrical performance of device than that with a low current.