Browsing by Author "Yang, Tsung-Hsi"

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Architecture of a n-type metal-oxide-semiconductor transistor with a compressive strained silicon-germanium channel fabricated on a silicon (110) substrate
(2007-09-06)
Luo, Guangli
;
Chien, Chao-Hsin
;
Yang, Tsung-Hsi
;
Chang, Chun-Yen
The present invention discloses an architecture of a NMOS transistor with a compressive strained Si—Ge channel fabricated on a silicon (110) substrate, which comprises: a p-silicon (110) substrate, two n+ ion-implanted regions functioning as the source and the drain respectively, a compressive strained Si—Ge channel layer, and a gate structure. The compressive strained Si—Ge channel layer is grown on the p-silicon (110) substrate to reduce the electron conductivity effective mass in the [1_l -10] crystallographic direction and to promote the electron mobility in the [1-10] crystallographic direction. Thus, the present invention can improve the electron mobility of a NMOS transistor via the channels fabricated on the silicon (110) substrate. Further, the NMOS transistor of the present invention can combine with a high-speed PMOS transistor on a silicon (110) substrate to form a high-performance CMOS transistor on the same silicon (110) substrate.
Dependence of GaN Defect Structure on the Growth Temperature of the AlN Buffer Layer
(2008)
Wong, Yuen-Yee
;
Chang, Edward Yi
;
Yang, Tsung-Hsi
;
Chang, Jet-Rung
;
Chen, Yi-Cheng
The defect structure of the GaN film grown on sapphire by plasma-assisted molecular beam epitaxy (PAMBE) technique was found to be dependent on the AlN buffer layer growth temperature. This buffer growth temperature controlled the defect density in GaN film but had shown contrary effects on the density of screw threading dislocation (TD) and edge TD. The density of screw TD was high on lower temperature buffer but low on the higher temperature buffer. Meanwhile the density of edge TD had shown the opposite. Further examinations have suggested that the defect structure was closely related to the stress in the GaN film, which can be controlled by the growth temperature of the AlN buffer. Using the 525 degrees C AlN buffer, optimum quality GaN Film with relatively low screw and edge TDs were achieved.
Dislocation reduction in GaN film using Ga-lean GaN buffer layer and migration enhanced epitaxy
(2011-07-29)
Wong, Yuen-Yee
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Chang, Edward Yi
;
Wu, Yue-Han
;
Hudait, Mantu K.
;
Yang, Tsung-Hsi
A GaN buffer layer grown under Ga-lean conditions by plasma-assisted molecular beam epitaxy (PAMBE) was used to reduce the dislocation density in a GaN film grown on a sapphire substrate. The Ga-lean buffer, with inclined trench walls on its surface, provided an effective way to bend the propagation direction of dislocations, and it reduced the dislocation density through recombination and annihilation processes. As a result, the edge dislocation density in the GaN film was reduced by approximately two orders of magnitude to 2 x 10(8) cm(-2). The rough surface of the Ga-lean buffer was recovered using migration enhanced epitaxy (MEE), a process of alternating deposition cycle of Ga atoms and N(2) radicals, during the PAMBE growth. By combining these two methods, a GaN film with high-crystalline-quality and atomically-flat surface can be achieved by PAMBE on a lattice mismatch substrate. (C) 2011 Elsevier B.V. All rights reserved.
Effect of Nitridation on the Regrowth Interface of AlGaN/GaN Structures Grown by Molecular Beam Epitaxy on GaN Templates
(2012-08-01)
Wong, Yuen-Yee
;
Huang, Wei-Ching
;
Trinh, Hai-Dang
;
Yang, Tsung-Hsi
;
Chang, Jet-Rung
AlGaN/GaN structures were regrown on GaN templates using plasma- assisted molecular beam epitaxy (PA-MBE). Prior to the regrowth, nitridation was performed using nitrogen plasma in the MBE chamber for different durations (0 min to 30 min). Direct-current measurements on high-electron-mobility transistor devices showed that good pinch-off characteristics and good interdevice isolation were achieved for samples prepared with a 30-min nitridation process. Current-voltage measurements on Schottky barrier diodes also revealed that, for samples prepared without nitridation, the reverse-bias gate leakage current was approximately two orders of magnitudes larger than that of samples prepared with a 30-min nitridation process. The improvement in the electrical properties is a result of contaminant removal at the regrowth interface which may be induced by the etching effect of nitridation.
Epitaxial Overgrowth of Gallium Nitride Nano-Rods on Silicon (111) Substrates by RF-Plasma-Assisted Molecular Beam Epitaxy
(2010)
Ku, Jui-Tai
;
Yang, Tsung-Hsi
;
Chang, Jet-Rung
;
Wong, Yuen-Yee
;
Chou, Wu-Ching
Strain-free gallium nitride (GaN) overgrowth on GaN nano-rods is realized by RF-plasma assisted molecular beam epitaxy (RF-MBE) on silicon (Si) substrate. The strain-free condition was identified by the strong free A exciton (FX(A)) photoluminescence (PL) peak at 3.478 eV and the E(2) high phonon Raman shift of 567 cm(-1). It is clearly demonstrated that the critical diameter of GaN nano-rods is around 80nm for the overgrowth of strain-free GaN. The blue-shift of PL peak energy and phonon Raman energy with decreasing the diameter of nano-rod result from the strain relaxation of overgrowth GaN. (C) 2010 The Japan Society of Applied Physics
Growth behaviour of Ge nano-islands on the nanosized Si{111} facets bordering on two {100} planes
(2006-10-28)
Ferng, Shyh-Shin
;
Yang, Tsung-Hsi
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Luo, Guangli
;
Yang, Kai-Ming
;
Hsieh, Ming-Feng
Si( 100) substrates were used to fabricate various nanosized {111} facets between the ( 100) planes using photolithography and anisotropic wet chemical etching. Following simultaneous Ge chemical vapour deposition on the neighbouring ( 100) and {111} facets, the Ge nano-island formation and distribution was observed on both the ( 100) terraces and the {111} side walls using a dynamical atomic force microscope. The nano-island formation on the nanosized {111} strip facets was found to be strongly suppressed upon reducing the strip width due primarily to the interaction of adatoms on the neighbouring facets. Specifically, the difference in the effective chemical potential of Ge adatoms on the two neighbouring facets leads to the depletion of nano-islands on the {111} strip with width < 500 nm under the growth condition used in this study.
Growth of GaAs expitaxial layers on Si substrate by using a novel GeSi buffer layer
(2007-06-14)
Chang, Edward Y.
;
Luo, Guangli
;
Yang, Tsung-Hsi
;
Chang, Chun-Yen
This invention provides a process for growing Ge epitaixial layers on Si substrate by using ultra-high vacuum chemical vapor deposition (UHVCVD), and subsequently growing a GaAs layer on Ge film of the surface of said Ge epitaixial layers by using metal organic chemical vapor deposition (MOCVD). The process comprises steps of, firstly, pre-cleaning a silicon wafer in a standard cleaning procedure, dipping it with HF solution and prebaking to remove its native oxide layer. Then, growing a high Ge-composition epitaixial layer, such as Si0.1Ge0.9 in a thickness of 0.8 μm on said Si substrate by using ultra-high vacuum chemical vapor deposition under certain conditions. Thus, many dislocations are generated and located near the interface and in the low of part of Si0.1Ge0.9 due to the large mismatch between this layer and Si substrate. Furthermore, a subsequent 0.8 μm Si0.05Ge0.95 layer, and/or optionally a further 0.8 μm Si0.02Ge0.98 layer, are grown. They form strained interfaces of said layers can bend and terminate the propagated upward dislocation very effectively. Therefore, a film of pure Ge is grown on the surface of said epitaixial layers. Finally, a GaAs epitaixial layer is grown on said Ge film by using MOCVD.
High-speed GaAs metal gate semiconductor field effect transistor structure grown on a composite Ge/Ge(x)Si(1-x)/Si substrate
(2007-04-15)
Luo, Guang-Li
;
Hsieh, Yen-Chang
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Chang, Edward Yi
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Pilkuhn, M. H.
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Chien, Chao-Hsin
In this study we used a low-pressure metal organic vapor phase epitaxy method to investigate the growth of GaAs metal gate semiconductor field effect transistor (MESFET) structures on a Si substrate. The buffer layer between the Si substrate and the grown GaAs epitaxial layers was a composite Ge/Si(0.05)Ge(0.95)/Si(0.1)Ge(0.9) metamorphic layer. We used transmission electron microscopy to observe the microstructures formed in the grown GaAs/Ge/Si(x)Ge(1-x)/Si material and atomic force microscopy to analyze the surface morphology and the formation of antiphase domains in the GaAs epitaxial layers. The measured Hall electron mobility in the channel layer of a MESFET structure grown on a 6 degrees misoriented Si substrate was 2015 cm(2) V(-1) s(-1) with a carrier concentration of 5.0x10(17) cm(-3). The MESFET device fabricated on this sample exhibited good current-voltage characteristics.
Method for forming III-nitrides semiconductor epilayer on the semiconductor substrate
(2009-04-16)
Chang, Chun-Yen
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Yang, Tsung-Hsi
;
Shen, Shih-Guo
GaN layer on semiconductor substrate is grown by using GaN nanorod buffer layer. Firstly, semiconductor substrate is cleaned and thermally degassed to remove the contaminant in the growth chamber. After the above step, the GaN nanorods layer is grown under the N-rich condition. Then, GaN epilayer is overgrown on the GaN nanorods layer under the Ga-rich condition for forming Group of III-Nitrides semiconductor layer on the semiconductor substrate.
The effect of AlN buffer growth parameters on the defect structure of GaN grown on sapphire by plasma-assisted molecular beam epitaxy
(2009-03-01)
Wong, Yuen-Yee
;
Chang, Edward Yi
;
Yang, Tsung-Hsi
;
Chang, Jet-Rung
;
Chen, Yi-Cheng
The defect structure of GaN film grown on sapphire by plasma-assisted molecular beam epitaxy (PAMBE) depends on the growth temperature and thickness of the aluminum nitride (AlN) buffer layer. High-resolution X-ray diffraction was used to measure symmetric (0 0 0 2) and asymmetric (1 0 (1) over bar 2) rocking curve (omega-scans) broadening, which allowed the estimation of screw threading dislocation (TD) and edge TD densities, respectively. For GaN grown on lower-temperature buffer, the density of screw TD was increased while the density of edge TD was decreased. Further examinations revealed that the edge TD was closely related to stress in GaN film and the screw TD was controlled by AlN surface roughness. Since the GaN defect was dominated by edge TD, the total TD was also effectively suppressed with the use of lower-temperature buffer with appropriate thickness. (C) 2009 Elsevier B.V. All rights reserved.
The Roles of Threading Dislocations on Electrical Properties of AlGaN/GaN Heterostructure Grown by MBE
(2010)
Wong, Yuen-Yee
;
Chang, Edward Yi
;
Yang, Tsung-Hsi
;
Chang, Jet-Rung
;
Ku, Jui-Tai
The role played by different types of threading dislocations (TDs) on the electrical properties of AlGaN/GaN heterostructure grown by plasma-assisted molecular beam epitaxy (MBE) was investigated. Samples with different defect structures and densities were prepared and measurements were taken from the same sample to study the correlative behavior of various TDs. From the Hall measurement, the electron mobility in two-dimensional electron gas channel was mainly controlled by the edge dislocation, which has a dominant amount in the material. The edge TDs acted as Coulomb scattering centers inside the channel and reduces the carrier mobility and increased its resistance. Screw TDs played a much significant role than edge TDs in determining the reverse-bias leakage current of Schottky barrier diodes. Leakage current is affected slightly by the reduction of free carrier density in the channel for samples with a higher edge TD density, but screw TD, which acted as the current leakage path, was more deleterious to the reverse-bias leakage current of AlGaN/GaN structure. (C) 2010 The Electrochemical Society. [DOI: 10.1149/1.3392365] All rights reserved.