Browsing by Author "Yang, Yi-Lun"

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Adhesion Properties of Electroplating Process Between Polyimide and Metal Layer for Polymer/Metal Hybrid Bonding
(2020-01-01)
Lu, Cheng-Hsien
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Yang, Yi-Lun
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Chen, Chiao-Pei
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Tsai, Bin-Ling
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Chen, Kuan-Neng
This article investigates the adhesion properties between the polyimide layers and the Ti/Cu layer after the electroplating process. The adhesion strength was evaluated by the four-point bending system, and the influence factors were confirmed by using different electroplating times and currents. The fracture interface after the four-point bending measurement was characterized, and the interface spectrum between the polyimide and the Ti/Cu layer was analyzed. The results showed that the modified polyimide-like material has better adhesion performance than the conventional polyimide. Moreover, the mechanism of degradation was proposed. As a result, the modified polyimide-like material can be applied in electroplating, a redistribution layer (RDL) formation, and packaging at the back-end-of-line processes.
Evaluation of Metal/Polymer Adhesion and Highly Reliable Four-Point Bending Test Using Stealth Dicing Method in 3-D Integration
(2020-06-01)
Yang, Yi-Lun
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Ito, Hiroyuki
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Kim, Young Suk
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Ohba, Takayuki
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Chen, Kuan-Neng
The adhesion between metal and polymer layer was studied using four-point bending tests. It was shown that as the annealing temperature increased, oxidation binding increased, which decreased adhesion and reduced the value. A new four-point bending test sample prepared using the stealth dicing method with a 100 & x0025; success rate was proposed for the first time. With samples prepared with stealth dicing, the region where crack extension occurred was smaller after the stress test. Less crack extension generated less loading on the samples. Owing to the coefficient of thermal expansion (CTE) mismatch after increasing the temperature in a highly accelerated stress test (HAST), a void formed in stealth dicing was made close to the interface between the silicon layer and the polymer layer after the stress test, and less crack extension occurred compared with samples kept at room temperature. The smaller loading force guarantees much more stable measurement with a higher success rate after the stress tests. The stealth dicing method can be applied to other structures, such as redistribution layers (RDLs).
Highly Reliable Four-Point Bending Test Using Stealth Dicing Method for Adhesion Evaluation
(2019-01-01)
Yang, Yi-Lun
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Liu, Jia-Ling
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Chen, Guan Wei
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Kodama, Shoichi
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Kobinata, Kyosuke
In this study, a sandwich structure (silicon/polymer/silicon) was prepared to demonstrate the adhesion strength between polymer and silicon layers using a four-point bending system. For the first time, the stealth dicing (SD) method was applied to the silicon layer to generate an initial crack, and the SD method was compared with the traditional method of forming a trench by blade dicing. From the experimental results, the SD method improved the test yield and showed a lower level of sudden force drop. As a result, SD is a highly reliable way to measure the adhesion strength using a four-point bending system.