Browsing by Author "Yeh, Y. T."

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A flexible mixed-signal/RF CMOS technology for implantable electronics applications
(2010-04-01)
Hsieh, C. Y.
;
Chen, C. S.
;
Tsou, W. A.
;
Yeh, Y. T.
;
Wen, K. A.
A novel post-CMOS fabrication process has been developed to transform a 0.18 mu m 1P6M mixed-signal/RF CMOS (complementary metal oxide semiconductor)-integrated circuit chips fabricated on an 8 inch SOI (silicon-on-insulator) wafer into flexible devices sandwiched between biocompatible material (10 mu m parylene-C on both sides in this case) and enables future implementation of implantable and fully integrated electronic devices. The functionality of the flexible integrated circuits is demonstrated by a low phase noise RF CMOS VCO (voltage-controlled oscillator) circuit in a ring oscillator configuration that operates at a few hundred MHz to GHz. We report here the associated post-processing technology to make these flexible IC chips and the characterization of both MOS transistors and the demonstration circuit on the flexible IC chip under bending stresses.
A flexible mixed-signal/RF CMOS technology for implantable electronics applications
(2010-04-01)
Hsieh, C. Y.
;
Chen, C. S.
;
Tsou, W. A.
;
Yeh, Y. T.
;
Wen, K. A.
A novel post-CMOS fabrication process has been developed to transform a 0.18 mu m 1P6M mixed-signal/RF CMOS (complementary metal oxide semiconductor)-integrated circuit chips fabricated on an 8 inch SOI (silicon-on-insulator) wafer into flexible devices sandwiched between biocompatible material (10 mu m parylene-C on both sides in this case) and enables future implementation of implantable and fully integrated electronic devices. The functionality of the flexible integrated circuits is demonstrated by a low phase noise RF CMOS VCO (voltage-controlled oscillator) circuit in a ring oscillator configuration that operates at a few hundred MHz to GHz. We report here the associated post-processing technology to make these flexible IC chips and the characterization of both MOS transistors and the demonstration circuit on the flexible IC chip under bending stresses.