Browsing by Author "Yu, C. C."

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Efficiency enhancement of GaN-based power-chip LEDs with sidewall roughness by natural lithography
(2007)
Huang, Hung-Wen
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Lai, C. F.
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Wang, W. C.
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Lu, T. C.
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Kuo, H. C.
This study reports the development of GaN-based power-chip light-emitting diodes (LEDs) with sidewall roughness using natural lithography with polystyrene spheres as the etching mask. At an injection current of 350 mA, the LED with sidewall roughness increased the light output intensity of the InGaN/GaN multiple quantum well LEDs by a factor of 1.26, indicating that the LED with sidewall roughness had larger light extraction efficiency. The wall-plug efficiency of GaN-based LED was increased by 26.5% with sidewall roughness. After 1000 h life test, it was found that normalized output power of power-chip LED with sidewall roughness did not show any significant degradation. (c) 2006 The Electrochemical Society.
Efficiency Improvement of GaN-Based LEDs With a SiO(2) Nanorod Array and a Patterned Sapphire Substrate
(2010-06-01)
Huang, H. W.
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Huang, J. K.
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Lin, C. H.
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Lee, K. Y.
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Hsu, H. W.
The enhancement of light extraction from GaN-based light-emitting diodes (LEDs) with a patterned sapphire substrate (PSS) and a SiO(2) 12-fold photonic quasi-crystal (PQC) structure using nanoimprint lithography is presented. At a driving current of 20 mA on transistor-outline-can package, the light output powers of LED with a PSS and LED with a PSS and a SiO(2) PQC structure are enhanced by 35% and 48%, compared with the conventional LED. In addition, the higher output power of the LED with a PSS and a SiO(2) PQC structure is due to better reflectance on PSS and higher epitaxial quality on an n-GaN using a SiO(2) 12-fold PQC structure pattern. These results provide promising potential to increase output powers of commercial light-emitting devices.
Efficiency Improvement of GaN-Based LEDs With a SiO2 Nanorod Array and a Patterned Sapphire Substrate
(2010-06-01)
Huang, H. W.
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Huang, J. K.
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Lin, C. H.
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Lee, K. Y.
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Hsu, H. W.
The enhancement of light extraction from GaN-based light-emitting diodes (LEDs) with a patterned sapphire substrate (PSS) and a SiO2 12-fold photonic quasi-crystal (PQC) structure using nanoimprint lithography is presented. At a driving current of 20 mA on transistor-outline-can package, the light output powers of LED with a PSS and LED with a PSS and a SiO2 PQC structure are enhanced by 35% and 48%, compared with the conventional LED. In addition, the higher output power of the LED with a PSS and a SiO2 PQC structure is due to better reflectance on PSS and higher epitaxial quality on an n-GaN using a SiO2 12-fold PQC structure pattern. These results provide promising potential to increase output powers of commercial light-emitting devices.
Electron emissions in InAs quantum dots containing a nitrogen incorporation induced defect state: the influence of thermal annealing
(2008-12-10)
Chen, J. F.
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Yu, C. C.
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Yang, C. H.
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電子物理學系
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Department of Electrophysics
With the incorporation of nitrogen (N) into InAs quantum dots (QDs), the carrier distribution near the QD displays electron emissions from a localized N-induced defect state at 0.34 eV and a weak emission at 0.15 eV from the QD. This defect state causes drastic carrier depletion in the neighboring GaAs bottom layer near the QD, which can effectively suppress tunneling emission for the QD excited states. As a result, electrons escape from the QD ground state through thermal emission to near the GaAs conduction band, rather than through thermal emission to the QD first excited state and a subsequent tunneling to the GaAs conduction band, as observed in InAs QDs without N incorporation. Thermal annealing can weaken the defect emission and enhance the QD emission, suggesting a removal of the defect state and a recovery of carriers in the QD. Increasing annealing temperature can significantly decrease the emission time and energy of the QD emission, which is explained by a weakening of tunneling suppression due to the removal of the defect state.
Enhanced light extraction of InGaN-based green LEDs by nano-imprinted 2D photonic crystal pattern
(2008-05-01)
Cheng, B. S.
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Chiu, C. H.
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Huang, K. J.
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Lai, C. F.
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Kuo, H. C.
In this paper, we propose a simple, low cost and mass producible nanoimprint lithography (NIL) method to texture the surface of GaN-based light emitting diodes (LEDs) with a two-dimensional photonic crystal (2DPC). Such a 2DPC structure not only enhanced the light output power but also changed the far-field pattern simultaneously. Also, a TiO(2)/SiO(2) omnidirectional reflector (ODR) was deposited on the backside of the LEDs to further increase the light output power. Under 350 mA current injection, it was found that forward voltages were 3.35, 3.34 and 3.75 V while the light output powers of the LEDs were 59.5, 92.5 and 112.1 mW for the conventional LED, the PCLED with 20 nm depth, and the PCLED with 120 nm depth all with chip size of 1 mm x 1 mm, respectively. A 88.4% enhancement in light output power of PCLED with a 120 nm depth and ODR on the backside could be achieved when compared to the conventional LED under the driving current of 350 mA. From the measurement results, it was also found that the NIL process does not degrade the electrical properties of the fabricated LEDs.
Enhanced light output from a nitride-based power chip of green light-emitting diodes with nano-rough surface using nanoimprint lithography
(2008-05-07)
Huang, H. W.
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Lin, C. H.
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Yu, C. C.
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Chiu, C. H.
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Lai, C. F.
Enhanced light extraction from a GaN-based power chip (PC) of green light-emitting diodes (LEDs) with a rough p-GaN surface using nanoimprint lithography is presented. At a driving current of 350 mA and with a chip size of 1 mm x 1 mm packaged on transistor outline (TO)-cans, the light output power of the green PC LEDs with nano-rough p-GaN surface is enhanced by 48% when compared with the same device without a rough p-GaN surface. In addition, by examining the radiation patterns, the green PC LED with nano-rough p-GaN surface shows stronger light extraction with a wider view angle. These results offer promising potential to enhance the light output powers of commercial light-emitting devices by using the technique of nanoimprint lithography under suitable nanopattern design.
Enhanced light output power of GaN-based vertical-injection light-emitting diodes with a 12-fold photonic quasi-crystal by nano-imprint lithography
(2009-08-12)
Huang, H. W.
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Lin, C. H.
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Lee, K. Y.
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Yu, C. C.
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Huang, J. K.
GaN-based thin-film vertical-injection light-emitting diodes (VLEDs) with a 12-fold photonic quasi-crystal (PQC) by nano-imprint lithography (NIL) are fabricated and presented. At a driving current of 20 mA and with a chip size of 350 mu m x 350 mu m, the light output power of our thin-film LED with a 12-fold PQC structure reaches 41 mW. This result is an enhancement of 78% when compared with the output power of a VLED without a PQC structure. In addition, the corresponding light radiation pattern shows a narrower beam shape due to the strong guided light extraction effect by the formed PQC structure in the vertical direction.
Enhancement of InGaN-GaN indium-tin-oxide flip-chip light-emitting diodes with TiO2-SiO2 multilayer stack omnidirectional reflector
(2006-09-01)
Lin, C. H.
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Lai, C. F.
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Ko, T. S.
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Huang, H. W.
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Kuo, H. C.
Enhancement of light extraction of GaN-based flip-chip indium-tin-oxide light-emitting diodes (FC ITO LEDs) with an onmidirectional reflector (ODR) is presented. The ODR consisting of alternating layers of TiO2 and SiO2 is designed to possess a complete photonic bandgap within the blue region of interest, and it is fabricated by E-beam deposition. At a driving current of 300 mA and a chip size of 1 mm x 1 mm, the light output power of the FC ITO LEDs with the ODR reaches 156 mW. This is an enhancement of 31% when compared with the same device with an Al mirror instead. Furthermore, by examining the radiation patterns, the FC ITO LED with the ODR shows stronger enhancement around the vertical direction. Our work offers promising potential for enhancing output powers of commercial light-emitting devices.
Enhancement of light output power of GaN-based light-emitting diodes using a SiO(2) nano-scale structure on a p-GaN surface
(2010-06-01)
Huang, H. W.
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Lai, F. I.
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Huang, J. K.
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Lin, C. H.
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Lee, K. Y.
GaN (gallium nitride)-based light-emitting diodes (LEDs) with a nano-scale SiO(2) structure between a transparent indium-tin oxide (ITO) layer and p-GaN were fabricated. The forward voltage at 20 mA for a GaN-based LED with a SiO(2) nano-scale structure was slightly higher than that of a conventional GaN-based LED because the total area of the p-type metal contact between the transparent ITO layer and p-GaN was smaller. However, the light output power for the GaN-based LED with a nano-scale structured SiO(2) at 20 mA was 24% higher than that for a conventional GaN-based LED structure. This increase in the light output power is mostly attributed to the scattering of light from the SiO(2) photonic quasi-crystal (PQC) layer.
Enhancement of light output power of GaN-based light-emitting diodes using a SiO2 nano-scale structure on a p-GaN surface
(2010-06-01)
Huang, H. W.
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Lai, F. I.
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Huang, J. K.
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Lin, C. H.
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Lee, K. Y.
GaN (gallium nitride)-based light-emitting diodes (LEDs) with a nano-scale SiO2 structure between a transparent indium-tin oxide (ITO) layer and p-GaN were fabricated. The forward voltage at 20 mA for a GaN-based LED with a SiO2 nano-scale structure was slightly higher than that of a conventional GaN-based LED because the total area of the p-type metal contact between the transparent ITO layer and p-GaN was smaller. However, the light output power for the GaN-based LED with a nano-scale structured SiO2 at 20 mA was 24% higher than that for a conventional GaN-based LED structure. This increase in the light output power is mostly attributed to the scattering of light from the SiO2 photonic quasi-crystal (PQC) layer.
Fabrication of InGaN/GaN nanorod light-emitting diodes with self-assembled Ni metal islands
(2007-11-07)
Chiu, C. H.
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Lu, T. C.
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Huang, H. W.
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Lai, C. F.
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Kao, C. C.
We report the fabrication of InGaN/GaN nanorod light-emitting diodes (LEDs) using inductively coupled plasma reactive-ion etching (ICP-RIE) and a photo-enhanced chemical (PEC) wet oxidation process via self-assembled Ni nanomasks. An enhancement by a factor of six times in photoluminescence (PL) intensities of nanorods made with the PEC process was achieved in comparison to that of the as-grown structure. The peak wavelength observed from PL measurement showed a blue shift of 3.8 nm for the nanorods made without the PEC oxidation process and 8.6 nm for the nanorods made with the PEC oxidation process from that of the as-grown LED sample. In addition, we have demonstrated electrically pumped nanorod LEDs with the electroluminescence spectrum showing more efficiency and a 10.5 nm blue-shifted peak with respect to the as-grown LED sample.
High Efficiency White LEDs with 2D Photonic Quasi-Crystal and Patterned Sapphire Substrate
(2008)
Chiu, C. H.
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Cheng, B. S.
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Kuo, H. C.
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Lu, T. C.
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Wang, S. C.
A high emitting efficiency GaN-based white LED with 2D PQC on surface and PSS were successfully fabricated. After packaging, 21% enhancement in emitting luminous flux was achieved under the driving current 20 mA. (C) 2008 Optical Society of America
Improvement of InGaN/GaN light emitting diode performance with a nano-roughened p-GaN surface by excimer laser-irradiation
(2006-10-10)
Huang, Hung-Wen
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Kao, C. C.
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Chu, J. T.
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Liang, W. D.
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Kuo, H. C.
In this paper, we reported the InGaN/GaN light emitting diode (LED) with a nano-roughened top p-GaN surface which caused by KrF excimer laser-irradiation. Comparing with the conventional LED, the brightness of InGaN/GaN light emitting diode (LED) was raised by a factor of 1.25 at 20 mA after KrF excimer laser-irradiation (250 mJ cm(-2) at 248 nm for 25 ns). Meanwhile, the operation voltage of InGaN/GaN LED was reduced from 3.55 to 3.3 V at 20 mA with 29% reduction in the series resistance. The causes for the brightness increase can be attributed to laser-irradiation induced nano-roughening of p-GaN surface. The reduction in the series resistance can be attributed to the increased contact area of nano-roughened surface and higher hole concentration after laser-irradiation. (c) 2005 Published by Elsevier B.V.
Improvement of light output in GaN-based power chip light-emitting diodes with a nano-rough surface by nanoimprint lithography
(2008-04-01)
Huang, H. W.
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Lin, C. H.
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Yu, C. C.
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Lee, B. D.
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Chiu, C. H.
The enhancement of light extraction of gallium nitride (GaN)-based power chip (PC) light-emitting diodes (LEDs) with a p-GaN rough surface by nanoimprint lithography (NIL) is presented. At a driving current of 350 mA and a chip size of 1 mm x 1 mm, the light output power of the PC LEDs with a p-GaN rough surface (etching depth from 130 to 150 nm) showed an enhancement of 24% on wafer when compared with the same device without NIL. Current-voltage results indicated an ohmic contact by the increase in the contact area of the nano-roughened surface at 200 mA. This paper offers a promising potential for enhancing the output powers of commercial LEDs.
Investigation of GaN-based light emitting diodes with nano-hole patterned sapphire substrate (NHPSS) by nano-imprint lithography
(2009-08-25)
Huang, H. W.
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Lin, C. H.
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Huang, J. K.
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Lee, K. Y.
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Lin, C. F.
In this paper, gallium-nitride (GaN)-based light-emitting diodes (LEDs) with nano-hole patterned sapphire (NHPSS) by nano-imprint lithography are fabricated and investigated. At an injection current of 20mA, the LED with NHPSS increased the light output power of the InGaN/GaN multiple quantum well LEDs by a factor of 1.33, and the wall-plug efficiency is 30% higher at 20mA indicating that the LED with NHPSS had larger light extraction efficiency. In addition, by examining the radiation patterns, the LED with NHPSS shows stronger light extraction with a wider view angle. These results offer promising potential to enhance the light output powers of commercial light-emitting devices using the technique of nano-imprint lithography. (C) 2009 Elsevier B.V. All rights reserved.
Investigation of GaN-based vertical-injection light-emitting diodes with GaN nano-cone structure by ICP etching
(2008-07-25)
Huang, H. W.
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Lin, C. H.
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Yu, C. C.
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Lee, K. Y.
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Lee, B. D.
The GaN-based thin-film vertical-injection LEDs (VLEDs) with GaN nano-cone structures are fabricated and presented. Under the process conditions of fixed Cl(2)/Ar now rate of 10/25sccm and ICP/bias power of 200/200W, the GaN nano-cone structures are self-assembly formed with variable density of 1.5 x 10(7) to 1.4 x 10(1) cm(-2) and variable depth of 0.56-1.34 mu m when varying the ICP chamber pressure. At a driving current of 350mA and with chip size of 1 mm x 1 mm, the light output power of our thin-film LED with a specific GaN nano-cone structure reaches 224 mW which is enhanced by 160% when compared with the output power of conventional VLED. In addition, the corresponding light radiation pattern Shows Much higher light intensity Clue to the strong light scattering effect by the formed nano-cone Structure. (C) 2008 Elsevier B.V. All rights reserved.
Investigation of InGaN/GaN power chip light emitting diodes with TiO(2)/SiO(2) omnidirectional reflector
(2008-12-01)
Huang, H. W.
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Lin, C. H.
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Yu, C. C.
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Lee, B. D.
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Kuo, H. C.
Enhancements of light extraction of GaN-based power chip (PC) LEDs with and without rough surface on p-GaN and TiO(2)/SiO(2) omnidirectional reflector (ODR) on the bottom are presented. Motivated by phosphor-conversion white light applications, the peak-emitting wavelength of our studied PC LEDs is chosen to be 455 nm and the fabricated ODR is designed for the same wavelength regime. At a driving current of 350 mA and a chip size of 1 mm x 1 mm on a TO-can package, the light output power of the PC LED with ODR on the bottom and pit type of rough surface on p-GaN is enhanced by 67% when compared with the same device without ODR and rough surface. Furthermore, by examining the radiation patterns, the PC LED with the ODR and rough surface shows stronger enhancement around the vertical direction. Our results provide promising potential to increase output powers of commercial light emitting devices, especially for white light applications.
Light Extraction Efficiency Enhancement of GaN-Based Light Emitting Diodes on n-GaN Layer Using a SiO(2) Photonic Quasi-Crystal Overgrowth
(2010-10-01)
Huang, H. W.
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Lee, K. Y.
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Huang, J. K.
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Lin, C. H.
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Lin, C. F.
In this paper, GaN-based LEDs with a SiO(2) photonic quasi-crystal (PQC) pattern on an n-GaN layer by nano-imprint lithography (NIL) are fabricated and investigated. At a driving current of 20 mA on Transistor Outline (TO)-can package, the better light output power of LED III (d = 1.2 mu m) was enhanced by a factor of 1.20. After 1000 h life test (55 degrees C/50 mA) condition, Normalized output power of LED with a SiO(2) PQC pattern (LED III (d = 1.2 mu m)) on an n-GaN layer only decreased by 5%. This results offer promising potential to enhance the light output power of commercial light-emitting devices using the technique of nano-imprint lithography.
Light extraction enhancement of InGaN-based green LEDs with a composite omnidirectional reflector
(2006-12-01)
Lin, C. H.
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Kuo, H. C.
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Lai, C. F.
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Huang, H. W.
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Leung, K. M.
We have designed, fabricated and measured the electroluminescence of InGaN-based green light-emitting diodes ( LEDs) having composite omni-directional reflectors ( ODRs) deposited on their backside. The composite ODR is composed of a stack of two individual ODRs, each of which is made of alternating layers of TiO2 and SiO2 with a thickness ratio that gives the largest possible 1D photonic bandgap. The lattice constants of these individual ODRs are chosen so that the effective bandgap of the resulting ODR completely covers the emission spectrum of the LEDs. The effective bandgap of our ODR extends from 498 nm to 548 nm. At a driving current of 300 mA, and with the LED emission peak at about 525 nm and a FWHM of about 35 nm, the light output powers of the LED with the composite ODR and the LED with a conventional Ti/Al metal reflector are found to be 52.9 mW and 40.7 mW, respectively. This 30% light extraction enhancement can be attributed to our composite ODR which has a higher reflectance, a lower optical absorption and a wider reflection angle compared with the Ti/Al reflector.
Optical properties of In0.3Ga0.7N/GaN green emission nanorods fabricated by plasma etching
(2007-08-22)
Chiu, C. H.
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Lo, M. H.
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Lai, C. F.
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Lu, T. C.
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Huang, H. W.
In this study, we have fabricated In0.3Ga0.7N/GaN green emission nanorods and demonstrated optical enhancement by photoluminescence (PL) measurements. An enhancement factor of 3.5 and an emission peak blue-shift of 6.6 nm were observed at 300 K for the green emission nanorods structure in comparison to the as-grown flat surface structure. The blue-shift phenomenon from the nanorod structure could be caused by a partial reduction of the internal piezoelectric field. However, the similar carrier decay time for the green emission nanorod structure and the as-grown flat surface structure observed in low-temperature time-resolved PL measurements indicates that the dominant optical enhancement mechanism of the green emission nanorod structure could be mainly resulting from the large emission surface areas and the multiple scattering paths between the nanorods.