Browsing by Author "Yu, CC"

Now showing 1 - 20 of 25

Beryllium-implanted P-type GaN with high carrier concentration
(2001-05-01)
Yu, CC
;
Chu, CF
;
Tsai, JY
;
Lin, CF
;
Lan, WH
We report the results of beryllium implantation in Mg-doped GaN to obtain a high hole concentration and lower activation energy for Mg. The metal organic chemical vapor deposition (MOCVD)-grown Mg-doped GaN samples were implanted with Be ions at two different energies of 50 keV and 150 keV and a dose of 10(14) cm(-2). The implemented samples were subsequently annealed at 1100 degreesC for 60 s. The annealed samples showed an increase of hole concentration by three orders of magnitude from the non-implanted value of 5.5 x 10(16) to 8.1 x 10(19) cm(-3) as determined by Hall measurement. The activation energy of Mg dopants for the implanted annealed samples estimated from the temperature dependence of the photoluminescence data is about 170 meV, which is nearly 30% lower than that for the as-grown samples.
Comparison of p-side down and p-side up GaN light-emitting diodes fabricated by laser lift-off
(2003-02-15)
Chu, CF
;
Yu, CC
;
Cheng, HC
;
Lin, CF
;
Wang, SC
The performance characteristics of laser lift-off (LLO) freestanding InGaN/GaN multiple quantum well (MQW) light-emitting diodes (LEDs) mounted on a Cu substrate with p-side up, and p-side down configurations were determined and compared. The InGaN/GaN MQW LED structures, which were originally fabricated on a sapphire substrate, were transferred to a Cu substrate by the LLO process into two different configurations, namely p-side up and p-side down with the same Ni/Pd/Au p-contact metallizations. Both p-side down and p-side up LLO-LEDs showed a higher current operation capability up to 400 mA than the original LEDs on the sapphire substrate. The p-side down LLO-LEDs showed a nearly eightfold increase in the light output power compared to the p-side up LLO-LEDs. The p-side down LLO-LEDs also showed a more stable wavelength emission spectrum than the p-side up ones.
Effect of rapid thermal annealing on beryllium implanted p-type GaN
(2004-03-25)
Huang, HW
;
Kao, CC
;
Tsai, JY
;
Yu, CC
;
Chu, CF
We report the results of rapid thermal annealing (RTA) effect on beryllium implanted in situ activated p-type GaN samples and investigate the ramping and isothermal annealing effect of RTA process for these samples. It is found that the optimum RTA condition is at the temperature of 1100 degreesC for 15 s. Furthermore, with equal total isothermal time of 60 s, we compared the multiple step annealing (MSA) at 1100 degreesC for four periods with single step annealing (SSA) for one period at the same annealing temperature of 1100 degreesC, and observed that the ramping effect with MSA could repair Be-related complex defect, and one time, long period isothermal annealing effect with SSA seems to induce much more defect. It seems that the multiple step annealing is more effective and induce less defect than single step annealing for Be-implanted in situ activated p-type GaN samples. (C) 2004 Elsevier B.V. All rights reserved.
Electrical and optical properties of beryllium-implanted Mg-doped GaN
(2002-08-15)
Yu, CC
;
Chu, CF
;
Tsai, JY
;
Lin, CF
;
Wang, SC
We investigated the electrical and optical characteristics of beryllium implanted Mg-doped GaN materials. The Mg-doped GaN samples were grown by metalorganic chemical vapor deposition system and implanted with Be ions at two different energies of 50 and 150 keV and two different doses of about 10(13) and 10(14) cm(-2). The implanted samples were subsequently rapidly thermal annealed at 900, 1000, and 1100 degreesC for various periods. The annealed samples showed an increase of hole concentration by three orders of magnitude from nonimplanted value of 5.5x10(16) to 8.1x10(19) cm(-3) as obtained by Hall measurement. The high hole concentration samples also showed low specific resistance ohmic contact of about 10(-3) Omega cm(2) and 10(-6) Omega cm(2) using Ni/Au and Ni/Pd/Au metallization, respectively, without any further annealing process. It is also found from the temperature dependent photoluminescence that the activation energy of Mg dopants of the Be implanted samples has an estimated value of about 170 meV, which is nearly 30% lower than the as-grown samples of about 250 meV. The crystal quality and surface morphology of the Be implanted samples measured by x-ray diffraction and atomic force microscopy show no obvious degradation in the crystal quality and surface morphology. (C) 2002 American Institute of Physics.
Enhanced light output in InGaN-based light-emitting diodes with onmidirectional one-dimensional photonic crystals
(2006-03-01)
Lin, CH
;
Tsai, JY
;
Kao, CC
;
Kuo, HC
;
Yu, CC
We have Successfully designed and fabricated GaN-based light-emitting diodes (LEDs) containing an omnidirectional one-dimensional photonic crystal (ID PC). The ID PC is composed of alternatively stacked TiO2 and SiO2 layers designed to possess a photonic band gap (PBG) within the blue regime of interest. With the same multiple quantum well (MQW) emission peak at approximately 450 nm and a driving Current of 20 mA, the light output powers of the LED with and without the ID PC are approximately 11.7 and 6.5 mW, respectively. The enhancement in light extraction of our LED with ID PC demonstrates that a property designed omnidirectional ID PC can have a higher reflectance and a wider reflection angle than a conventional distributed Bragg reflector (DBR). Our work shows promising potential for the enhancement of output powers of commercial light emitting devices.
Enhanced light output in InGaN/GaN light emitting diodes with excimer laser etching surfaces
(2006-04-01)
Huang, HW
;
Chu, JT
;
Kao, CC
;
Hsueh, TH
;
Lu, TC
The InGaN/GaN light-emitting diode (LED) with a top p-GaN surface nanoroughened using Ni nanomasks and laser etching has been fabricated. The light output power of the InGaN/GaN LED with a nanoroughened top p-GaN surface is 1.55-fold that of a conventional LED. The series resistance of InGaN/GaN LED was reduced by 32% due to the increase in the contact area of the nanoroughened surface.
Enhanced light output of an InGaN/GaN light emitting diode with a nano-roughened p-GaN surface
(2005-09-01)
Huang, HW
;
Chu, JT
;
Kao, CC
;
Hseuh, TH
;
Lu, TC
This investigation describes the development of an InGaN/GaN light emitting diode (LED) with a nano-roughened top p-GaN surface using an Ni nano-mask and laser etching. The light output of the InGaN/GaN LED with a nano-roughened top p-GaN surface is 1.55 times that of a conventional LED, and the wall-plug efficiency is 68% higher at 20 mA. The series resistance of the InGaN/GaN LED was reduced by 32% by the increase in the contact area of the nano-roughened surface.
Fabrication and characteristics of GaN-based microcavity light-emitting diodes with high reflectivity AIN/GaN distributed Bragg reflectors
(2006-04-01)
Peng, YC
;
Kao, CC
;
Huang, HW
;
Chu, JT
;
Lu, TC
In this paper, we report a GaN-based microcavity light-emitting diode (MCLED) which is composed of 25 pairs of high-reflectivity GaN/AlN distributed Bragg reflector (DBR) and 6 pairs of ex-situ deposited SiO2/TiO2 dielectric mirrors. The electroluminescence peak of this structure matched well with the high reflectance area of the top and bottom DBRs, and shows a narrow emission of approximately 6.7 nm. The fabricated device also shows a more excellent performance on the stability of the emission peak wavelength while varying injection current density and operating temperature than a regular LED.
Fabrication and micro-photoluminescence investigation of Mg-doped gallium nitride nanorods
(2005-04-01)
Chang, YH
;
Hsueh, TH
;
Lai, FI
;
Chang, CW
;
Yu, CC
High-density magnesium (Mg)-doped gallium nitride (GaN) nanorods were fabricated by inductively coupled plasma reactive ion etching from a GaN film and had a mean length of approximately 50nm. A large blue-shift was observed in the photoluminescence (PL) peak energy of Mg-doped GaN nanorods under HeCd laser (325 nm) excitation. The PL spectra of the nanorods show a typical donor-acceptor-pair (DAP) emission at approximately 3.0 eV with a large blue-shift compared to that of the Mg-doped GaN film. The blue-shift energy increases from 8 meV to 67 meV as the excitation intensity varies from 12 kW/cm(2) to 56 kW/cm(2). Possible reasons for the power dependence of the spectral shift in the PL emission energy are discussed.
Fabrication of GaN-based nanorod light emitting diodes using self-assemble nickel nano-mask and inductively coupled plasma reactive ion etching
(2004-10-25)
Huang, HW
;
Kao, CC
;
Hsueh, TH
;
Yu, CC
;
Lin, CF
We report a novel method to fabricate GaN-based nanorod light emitting diodes (LEDs) with controllable dimension and density using self-assemble nickel (Ni) and Ni/Si3N4 nano-masks and inductively coupled plasma reactive ion etching (ICP-RIE). Under the fixed Cl-2/Ar flow rate of 50/20 sccm. ICP/Bias power of 400/100 W and chamber pressure of 0.67 Pa, the GaN-based nanorod LEDs were fabricated with density of 2.2 x 10(9) to 3 x 10(10) cm(-2) and dimension of 150-60 nm by self assemble Ni nano-masks with various size. The size of Ni/Si3N4 nano-mask was control by the thickness Ni film ranging 150-50 Angstrom and rapid thermal annealing condition. The technique offers a controllable method of fabrication of GaN-based nanorod LEDs and should be applicable for fabrication of the others III-V nanoscale photonic and electronic devices. (C) 2004 Elsevier B.V. All rights reserved.
Fabrication of magnesium-doped gallium nitride nanorods and microphotoluminescence characteristics
(2006-05-01)
Lai, FI
;
Kuo, SY
;
Chang, YH
;
Huang, HW
;
Chang, CW
High density magnesium (Mg)-doped gallium nitride (GaN) nanorods were fabricated by inductively coupled plasma reactive ion etching technique from the epitaxial film. Under the fixed Cl-2/Ar flow rate of 10/25 SCCM (SCCM denotes cubic centimeter per minute at STP) and inductively coupled plasma/bias power of 200/200 W, the nanorods were fabricated with a density of 10(8)-10(10) cm(2) and dimension of 20-100 nm by varying the chamber pressure from 10 to 30 mTorr. A large blueshift was observed in the photoluminescence (PL) peak energy of Mg-doped GaN nanorods under HeCd laser (325 nm) excitation. The PL spectra of nanorods show a typical donor-acceptor-pair emission around 3.0 eV with a large blueshift compared to the Mg-doped GaN film. The blueshift energy increases from 8 to 67 meV as the excitation intensity varies from 12 to 56 kW/cm(2). Possible reasons causing the power dependence of spectral shift in the PL emission energy are discussed. 2006 American Vacuum Society.
Gallium nitride nanorods fabricated by inductively coupled plasma reactive ion etching
(2002-08-15)
Yu, CC
;
Chu, CF
;
Tsai, JY
;
Huang, HW
;
Hsueh, TH
We report a novel method of fabricating gallium nitride (GaN) nanotods of controllable dimension and density from GaN epitaxial film using inductively coupled plasma reactive ion etching (ICP-RIE). The GaN epitaxial film was grown on a sapphire substrate by metal-organic chemical vapor deposition. Under the fixed Cl-2/Ar flow rate of 10/25 sccm and ICP/bias power of 200/200 W. the GaN nanorods and array were fabricated with a density of 10(8)-10(10) cm(-2) and dimension of 20-100 nm by varying the chamber pressure from 10 to 30 mTorr. The technique offers one-step, controllable method for the fabrication of GaN nanostructures and should be applicable for the fabrication of GaN-based nano-optoelectronic devices.
Growth rate control of fumarase (fumA) gene expression in Escherichia coli
(1997-07-31)
Tseng, CP
;
Yu, CC
;
Hwang, SM
;
交大名義發表
;
National Chiao Tung University
High etching rate of GaN films by KrF excimer laser
(2001-05-22)
Chu, CF
;
Lee, CK
;
Yu, CC
;
Wang, YK
;
Tasi, JY
A study of laser processing of gallium nitride (GaN) material is reported. A pulsed KrF excimer laser at 248 nm with 20-nsec pulse width and 1 Hz repetition rate is used to etch the GaN film. We establish the material etching parameters under different environmental conditions. By changing the pulsed energy at constant pulse numbers, ablation of GaN surface was observed at threshold laser fluence about 0.3 J cm(-2). Laser etching increase with reducing environment pressure. Al 1.0 J cm (-2) laser fluence, the etching fate is about 35 nm per pulse at atmosphere pressure and increases to 60 nm per pulse at low pressure. The etched depth also increases with increasing laser fluence. The surface morphology of the etched surface was also investigated. (C) 2001 Elsevier Science B.V. All rights reserved.
Improvement of InGaN-GaN light-emitting diode performance with a nano-roughened p-GaN surface
(2005-05-01)
Huang, HW
;
Kao, CC
;
Chu, JI
;
Kuo, HC
;
Wang, SC
This investigation describes the development of InGaN-GaN light-emitting diode (LED) with a nano-roughened top p-GaN surface which uses Ni nano-mask and wet etching. The light output of the InGaN-GaN LED with a nano-roughened top p-GaN surface is 1.4 times that of a conventional LED, and wall-plug efficiency is 45% higher. The operating voltage of InGaN-GaN LED was reduced from 3.65 to 3.5 V at 20 mA and the series resistance was reduced by 20%. The light output is increased by the nano-roughening of the top p-GaN surface. The reduction in the series resistance can be attributed to the increase in the contact area of nano-roughened surface.
InGaN-based light-emitting diode with undercut side wall
(2004)
Kao, CC
;
Chu, JT
;
Huang, HW
;
Peng, YC
;
Yu, CC
Investigation of beryllium implanted P-type GaN
(2001-05-22)
Yu, CC
;
Chu, CF
;
Tsai, JY
;
Wang, SC
;
光電工程學系
We report the preliminary results of beryllium implanted into P-type GaN and the effects on the characteristic of Mg-doped P-GaN. These samples were implanted with Be ions were implanted with two different energies of 50 and 150 keV at two different doses of similar to 10(13) and 10(14) cm(-2) at room temperature. Surface morphology and photoluminescence measurements are presented. (C) 2001 Elsevier Science B.V. All rights reserved.
Investigation of GaN LED with Be-implanted Mg-doped GaN layer
(2004-10-15)
Huang, HW
;
Kao, CC
;
Chu, JT
;
Kuo, HC
;
Wang, SC
We report the electrical and optical characteristics of GaN light emitting diode (LED) with beryllium (Be) implanted Mg-doped GaN layer. The p-type layer of Be-implanted GaN LED showed a higher hole carrier concentration of 2.3 x 10(18)CM(-3) and low specific contact resistance value of 2.0 x 10(-4) Omegacm(2) than as-grown p-GaN LED samples without Be-implantation. The Be-implanted GaN LEDs with InGaN/GaN MQW show slightly lower light output (about 10%) than the as-grown GaN LEDs, caused by the high RTA temperature annealing process. (C) 2004 Elsevier B.V. All rights reserved.
Light-output enhancement in a nitride-based light-emitting diode with 22 degrees undercut sidewalls
(2005-01-01)
Kao, CC
;
Kuo, HC
;
Huang, HW
;
Chu, JT
;
Peng, YC
We successfully fabricated nitride-based light-emitting diodes (LEDs) with similar to 22degrees undercut sidewalls. The similar to 22degrees etching undercut sidewalls were achieved by controllable inductively coupled plasma reactive ion etching. With a 20-mA current injection, the output powers of the LED with similar to 22degrees undercut sidewalls and standard LED were 5.1 and 3 mW, respectively-a factor of 1.7 times enhancement. It was found that such undercut sidewalls could enhance the probability of escaping the photons outside from the LED in the near horizontal and in-plane directions. This simple and controllable method is beneficial to fabricate brighter LEDs.
Low-resistance ohmic contacts on p-type GaN using Ni/Pd/Au metallization
(2000-11-20)
Chu, CF
;
Yu, CC
;
Wang, YK
;
Tsai, JY
;
Lai, FI
In this letter, a low-resistance ohmic contact on p-type GaN using an alloy of Ni/Pd/Au is reported. The Mg doped p-type GaN samples were grown by metalorganic chemical vapor deposition with a carrier concentration of 4.1x10(17) cm(-3). The as-grown Mg doped samples were deposited with Ni (20 nm)/Pd (20 nm)/Au (100 nm) and then annealed in air, nitrogen, and oxygen ambient conditions at different annealing temperatures ranging from 350 to 650 degreesC. Linear I-V ohmic characteristics were observed with specific resistance as low as 1.0x10(-4) Omega cm(2) for the samples annealed in oxygen atmosphere. Similar contact metal composition was also deposited on Be-implanted p-type GaN samples with a carrier density of 8.1x10(19) cm(-3). Without further annealing process, the samples show good ohmic contact with a lowest specific resistance of 4.5x10(-6) Omega cm(2). (C) 2000 American Institute of Physics. [S0003-6951(00)01847-7].