Browsing by Author "Zheng, Jin-Cheng"

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An Electronic Synapse Device Based on Solid Electrolyte Resistive Random Access Memory
(2015-08-01)
Zhang, Wei
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Hu, Ying
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Chang, Ting-Chang
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Chang, Kuan-Chang
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Tsai, Tsung-Ming
The multilevel capability of solid electrolyte resistive random access memory (RRAM) with a Pt/GeSO/TiN structure was explored for potential use as a synapse device. By varying the cutoff voltage during the dc I-V cycles or the ac pulse programming voltage amplitudes, continuous multilevel conductance states were obtained. The reference Pt/GeO/TiN RRAM was fabricated to certify the multilevel capability and was due to the character of the GeS solid electrolyte. Finally, the property of gradual conductance states was exploited to demonstrate spike-timing-dependent plasticity learning, which suggests device\'s potential for use as an electronic synapse device for neuromorphic systems.
Effects of erbium doping of indium tin oxide electrode in resistive random access memory
(2016-03)
Chen, Po-Hsun
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Chang, Kuan-Chang
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Chang, Ting-Chang
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Tsai, Tsung-Ming
;
Pan, Chih-Hung
Identical insulators and bottom electrodes were fabricated and capped by an indium tin oxide (ITO) film, either undoped or doped with erbium (Er), as a top electrode. This distinctive top electrode dramatically altered the resistive random access memory (RRAM) characteristics, for example, lowering the operation current and enlarging the memory window. In addition, the RESET voltage increased, whereas the SET voltage remained almost the same. A conduction model of Er-doped ITO is proposed through current-voltage (I-V) measurement and current fitting to explain the resistance switching mechanism of Er-doped ITO RRAM and is confirmed by material analysis and reliability tests. (C) 2016 The Japan Society of Applied Physics
Effects of Varied Negative Stop Voltages on Current Self-Compliance in Indium Tin Oxide Resistance Random Access Memory
(2015-06-01)
Lin, Chih-Yang
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Chang, Kuan-Chang
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Chang, Ting-Chang
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Tsai, Tsung-Ming
;
Pan, Chih-Hung
We have previously investigated the automatic current compliance property for indium tin oxide (ITO) resistance random access memory (RRAM). Traditionally, for the purpose of protecting RRAM, it is necessary to set equipment current compliance during the set and forming processes of RRAM devices. ITO RRAM devices, however, have an intrinsic capability to limit their current. This letter examines this ITO RRAM current compliance in depth by applying a varied stop-voltage measurement method, where different negative stop voltages were adopted to manipulate oxygen ions. Combined with material analysis and conduction current fitting, a model was established.
Improvement of Resistive Switching Characteristic in Silicon Oxide-Based RRAM Through Hydride-Oxidation on Indium Tin Oxide Electrode by Supercritical CO2 Fluid
(2015-06-01)
Chang, Kuan-Chang
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Tsai, Tsung-Ming
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Chang, Ting-Chang
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Zhang, Rui
;
Chen, Kai-Huang
Supercritical carbon dioxide (SCCO2) fluid technology was applied to indium-tin-oxide (ITO) electrode to improve the resistive switching characteristic of silicon oxide RRAM through hydride oxidation for the first time. We found device power consumption can be effectively reduced so that side effects can be also restricted under device operation. By applying SCCO2 fluid, more oxygen ions will be introduced into the ITO electrode and thus the participation of net oxygen ions in the RRAM redox reaction will increase. Fourier transform spectroscopy and X-ray photoelectron spectroscopy were used to confirm hydride oxidation on ITO electrode. Combined with the current fitting results, we proposed a reaction model to explain the improvement of resistive switching in RRAM by SCCO2 fluids.
Improving Performance by Doping Gadolinium Into the Indium-Tin-Oxide Electrode in HfO2-Based Resistive Random Access Memory
(2016-05)
Chen, Po-Hsun
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Chang, Kuan-Chang
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Chang, Ting-Chang
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Tsai, Tsung-Ming
;
Pan, Chih-Hung
This letter investigates the characteristics of doping gadolinium (Gd) in an indium-tin-oxide (ITO) electrode in HfO2-based resistive random access memory (RRAM). Identical bottom electrodes and insulators were made but then capped by either pure ITO or a Gd: ITO top electrode. Doping Gd in the ITO electrode produces lower operation currents in both high-resistance state (HRS) and low-resistance state (LRS) as well as enlarging the memory window. This excellent performance suggests a remarkable potential to improve RRAM applications. Schottky emission mechanism dominates both HRS and LRS according to current fitting results, and is confirmed by temperature effect experiments. The resistive switching behavior of the Gd:ITO device is explained by our model and is also confirmed by material analysis and electrical measurements. Furthermore, reliability tests verify the Gd: ITO device\'s capability to perform data storage as a nonvolatile memory.
Influence of Oxygen Concentration on Self-Compliance RRAM in Indium Oxide Film
(2014-09-01)
Yang, Jyun-Bao
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Chang, Ting-Chang
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Huang, Jheng-Jie
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Chen, Yu-Ting
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Tseng, Hsueh-Chih
This letter investigates various oxygen concentrations in indium oxide films which induce different resistance switching behaviors, including two self-compliance behaviors and a two-step set process. The accumulated oxygen ions produce an oxygen-rich indium oxide film, which can be considered as a variable series resistor after the forming process. Analyses indicate that the lower self-compliance current can be attributed to this larger variable series resistor from the additional oxygen ions. The more significant oxidation reaction decreases the current of the high resistance state. Hence, power consumption can be reduced effectively.
Mechanism of Triple Ions Effect in GeSO Resistance Random Access Memory
(2015-06-01)
Zhang, Wei
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Hu, Ying
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Chang, Ting-Chang
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Tsai, Tsung-Ming
;
Chang, Kuan-Chang
In this letter, a triple-ion redox reaction has been proposed and investigated in GeSO-based resistance random access memory. Continuous multiresistance states can be obtained by applying a series of increasing cutoff voltages in both set and reset processes. Using data retention tests, these multistates in the set and reset processes were confirmed to be stable. The conduction mechanism gradually changed during reset process from space charge limited current to Schottky emission. A triple-ion reaction model has been proposed to reveal the chemical reaction properties in the resistive switching process.
Modifying Indium-Tin-Oxide by Gas Cosputtering for Use as an Insulator in Resistive Random Access Memory
(2016-11)
Chen, Po-Hsun
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Chang, Kuan-Chang
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Chang, Ting-Chang
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Tsai, Tsung-Ming
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Pan, Chih-Hung
In this paper, indium-tin-oxide (ITO) was used to act as both insulator and top electrode in resistive random access memory (RRAM) on identical bottom substrates. This is achieved by cosputtering an ITO target with nitride (N-2) or oxygen (O-2) gas as the insulator; then capping by an ITO electrode, such that both the rectifier and RRAM characteristics can be achieved before and after a forming process, respectively. In contrast, using pure ITO as an insulator does not exhibit RRAM behavior. To verify the rectifier and RRAM characteristics, material analyses and electrical measurements at various temperatures were conducted. Reliability tests including retention and endurance were also applied to verify the resistance switching stability. Finally, the rectifier and RRAM conduction models were proposed to examine the resistance switching behaviors. By applying the ITO material as both electrode and insulator, the resistance switching characteristic with high reliability is thus obtained.
Nitrogen Buffering Effect on Oxygen in Indium-Tin-Oxide-Capped Resistive Random Access Memory With NH3 Treatment
(2015-11-01)
Chen, Ji
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Chang, Kuan-Chang
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Chang, Ting-Chang
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Tsai, Tsung-Ming
;
Pan, Chih-Hung
In this letter, we demonstrate the differing influences of a nitrogen buffering effect in both the switching layer and the indium-tin-oxide (ITO) electrode layer of resistive random access memory (RRAM) which has undergone an NH3 treatment. The nitrogen buffering effect in the switching layer cannot counteract the electric field force, leading to similar I-V characteristics compared with the ITO/Hf:SiO2/TiN control structure RRAM. The nitrogen in the ITO electrode layer, however, works as an oxygen buffer and makes it easier for the redox reaction to occur, leading to improvements in performance, such as concentrated voltages and better endurance.
Obtaining Lower Forming Voltage and Self-Compliance Current by Using a Nitride Gas/Indium-Tin Oxide Insulator in Resistive Random Access Memory
(2016-12)
Chen, Po-Hsun
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Chang, Ting-Chang
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Chang, Kuan-Chang
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Tsai, Tsung-Ming
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Pan, Chih-Hung
This paper investigates the characteristics of applying indium-tin oxide (ITO) with and without nitride gas (N-2) as the insulator in resistive random access memory (RRAM). After cosputtering an ITO target with N-2 as the insulator and capping the same ITO material as the top electrode, the device exhibits rectifier and resistance switching characteristics before and after the forming process, respectively. The Schottky diodelike rectifier mechanism was also verified by various temperature measurements. Furthermore, robust resistance switching at a positive forming voltage, smaller than that required during negative bias forming, can be achieved. Both positive and negative forming processes are examined with current fitting results, which show different dominant mechanisms when using positive or negative biases. All these mechanisms have also been verified by temperature effect experiments, which confirmed the dominant conduction mechanisms. This, in combination with the fact that the positive forming voltage itself is smaller than the negative forming voltage, and decreases with device scale down, provides two highly beneficial results. This good performance achieved by using ITO with N-2 suggests significant progress of RRAM and remarkable potential applications.
Reducing operation voltages by introducing a low-k switching layer in indium-tin-oxide-based resistance random access memory
(2016-06)
Jin, Fu-Yuan
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Chang, Kuan-Chang
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Chang, Ting-Chang
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Tsai, Tsung-Ming
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Pan, Chih-Hung
In this letter, we inserted a low dielectric constant (low-k) or high dielectric constant (high-k) material as a switching layer in indium-tin-oxide-based resistive random-access memory. After measuring the two samples, we found that the low-k material device has very low operating voltages (-80 and 110mV for SET and RESET operations, respectively). Current fitting results were then used with the COMSOL software package to simulate electric field distribution in the layers. After combining the electrical measurement results with simulations, a conduction model was proposed to explain resistance switching behaviors in the two structures. (C) 2016 The Japan Society of Applied Physics
Resistive Switching Mechanism of Oxygen-Rich Indium Tin Oxide Resistance Random Access Memory
(2016-04)
Tsai, Tsung-Ming
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Chang, Kuan-Chang
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Chang, Ting-Chang
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Zhang, Rui
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Wang, Tong
DThis letter investigates the double-ended resistive switching characteristics of indium tin oxide (ITO) resistance random access memory (RRAM). Resistive switching can be achieved around both the active TiN electrode and the inert Pt electrode. In addition, complementary resistance switching (CRS) characteristics can be observed without current compliance during dc voltage sweep operations. Electrical measurement data fitting results indicate that the oxygen-rich ITO near top and bottom electrodes works as a double-ended resistive switching layer. Based on the analysis of the current conduction mechanism, we propose a physical model to interpret the CRS behaviors in ITO RRAM devices.
Suppression of endurance degradation by applying constant voltage stress in one-transistor and one-resistor resistive random access memory
(2017-01-01)
Su, Yu-Ting
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Chang, Ting-Chang
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Tsai, Tsung-Ming
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Chang, Kuan-Chang
;
Chu, Tian-Jian
In this letter we demonstrate an operation method that effectively suppresses endurance degradation. After many operations, the off-state of resistance random access memory (RRAM) degrades. This degradation is caused by reduction of active oxygen ions participating in the set process, as determined by current fitting of current-voltage (I-V) curves obtained from the endurance test between the interval of seventy to one hundred million operations. To address this problem, we propose the application of constant voltage stress after every five million operations during the endurance test. The experimental result shows that this method can maintain oxygen ions at the proper depth in the electrode and improve RRAM reliability. (c) 2017 The Japan Society of Applied Physics