Browsing by Author "Zhu, Y."

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Ferromagnetic Enhancement of CE-Type Spin Ordering in (Pr, Ca)MnO(3)
(2011-05-04)
Zhou, S. Y.
;
Zhu, Y.
;
Langner, M. C.
;
Chuang, Y. -D.
;
Yu, P.
We present resonant soft x-ray scattering results from small bandwidth manganites (Pr, Ca)MnO(3), which show that the CE-type spin ordering (SO) at the phase boundary is stabilized only below the canted antiferromagnetic transition temperature and enhanced by ferromagnetism in the macroscopically insulating state (FM-I). Our results reveal the fragility of the CE-type ordering that underpins the colossal magnetoresistance effect in this system, as well as an unexpected cooperative interplay between FM-I and CE-type SO which is in contrast to the competitive interplay between the ferromagnetic metallic state and CE-type ordering.
Ferromagnetic Enhancement of CE-Type Spin Ordering in (Pr, Ca)MnO3
(2011-05-04)
Zhou, S. Y.
;
Zhu, Y.
;
Langner, M. C.
;
Chuang, Y. -D.
;
Yu, P.
We present resonant soft x-ray scattering results from small bandwidth manganites (Pr, Ca)MnO3, which show that the CE-type spin ordering (SO) at the phase boundary is stabilized only below the canted antiferromagnetic transition temperature and enhanced by ferromagnetism in the macroscopically insulating state (FM-I). Our results reveal the fragility of the CE-type ordering that underpins the colossal magnetoresistance effect in this system, as well as an unexpected cooperative interplay between FM-I and CE-type SO which is in contrast to the competitive interplay between the ferromagnetic metallic state and CE-type ordering.
Investigation and Effects of Wafer Bow in 3D Integration Bonding Schemes
(2010-12-01)
Chen, K. N.
;
Zhu, Y.
;
Wu, W. W.
;
Reif, R.
;
材料科學與工程學系
This paper investigates and reviews the effects of wafer bow in three- dimensional (3D) integration bonding schemes, including copper wafer bonding and oxide fusion wafer bonding with silicon on insulator (SOI)-based layer transfer technology. Wafer bow criteria for good bonding quality and fabrication techniques to minimize wafer bow are introduced for 3D integration technology and applications.