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Browsing by Author "Zuo, G."

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    Reliability and structural design of a wafer-level 3D integration scheme with W TSVs based on Cu-oxide hybrid wafer bonding
    (2010)
    Chen, K. N.
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    Shaw, T. M.
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    Cabral, C., Jr.
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    Zuo, G.
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    電子工程學系及電子研究所
    We demonstrate a wafer-level 3D integration scheme with W TSVs based on Cu-oxide hybrid wafer bonding. Hybrid Cu-oxide hybrid bonding shows excellent bond quality and performances in terms of alignment, bond strength, and ambient permeation oxidation. Excellent performances of initial reliability and quality evaluations for Cu-oxide hybrid bonding are key milestones in proving manufacturability of 3D integration technology.