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公開日期標題作者
1-一月-2013Analysis of bump resistance and current distribution of ultra-fine-pitch microbumpsChang, Y. W.; Peng, H. Y.; Yang, R. W.; Chen, Chih; Chang, T. C.; Zhan, C. J.; Juang, J. Y.; Huang, Annie T.; 材料科學與工程學系; Department of Materials Science and Engineering
1-九月-2012Electromigration Failure Mechanism in Sn-Cu Solder Alloys with OSP Cu Surface FinishChu, Ming-Hui; Liang, S. W.; Chen, Chih; Huang, Annie T.; 材料科學與工程學系; Department of Materials Science and Engineering
15-十二月-2014Fast phase transformation due to electromigration of 18 mu m microbumps in three-dimensional integrated-circuit integrationChang, Y. W.; Chen, Chih; Chang, T. C.; Zhan, C. J.; Juang, J. Y.; Huang, Annie T.; 材料科學與工程學系; Department of Materials Science and Engineering
1-十一月-2006Hermetic packaging using eutectic SnPb solder and Cr/Ni/Cu metallurgy layerHuang, Annie T.; Chou, Chung-Kuang; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
15-二月-2012Influence of Cu column under-bump-metallizations on current crowding and Joule heating effects of electromigration in flip-chip solder jointsLiang, Y. C.; Tsao, W. A.; Chen, Chih; Yao, Da-Jeng; Huang, Annie T.; Lai, Yi-Shao; 材料科學與工程學系; Department of Materials Science and Engineering
1-五月-2012Thermomigration of Ti in flip-chip solder jointsChen, Hsiao-Yun; Lin, Han-Wen; Liu, Chien-Min; Chang, Yuan-Wei; Huang, Annie T.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
顯示 1 到 6 筆資料，總共 6 筆