Browsing by Author Huang, Annie T.
Showing results 1 to 6 of 6
| Issue Date | Title | Author(s) |
| 1-Jan-2013 | Analysis of bump resistance and current distribution of ultra-fine-pitch microbumps | Chang, Y. W.; Peng, H. Y.; Yang, R. W.; Chen, Chih; Chang, T. C.; Zhan, C. J.; Juang, J. Y.; Huang, Annie T.; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-Sep-2012 | Electromigration Failure Mechanism in Sn-Cu Solder Alloys with OSP Cu Surface Finish | Chu, Ming-Hui; Liang, S. W.; Chen, Chih; Huang, Annie T.; 材料科學與工程學系; Department of Materials Science and Engineering |
| 15-Dec-2014 | Fast phase transformation due to electromigration of 18 mu m microbumps in three-dimensional integrated-circuit integration | Chang, Y. W.; Chen, Chih; Chang, T. C.; Zhan, C. J.; Juang, J. Y.; Huang, Annie T.; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-Nov-2006 | Hermetic packaging using eutectic SnPb solder and Cr/Ni/Cu metallurgy layer | Huang, Annie T.; Chou, Chung-Kuang; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering |
| 15-Feb-2012 | Influence of Cu column under-bump-metallizations on current crowding and Joule heating effects of electromigration in flip-chip solder joints | Liang, Y. C.; Tsao, W. A.; Chen, Chih; Yao, Da-Jeng; Huang, Annie T.; Lai, Yi-Shao; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-May-2012 | Thermomigration of Ti in flip-chip solder joints | Chen, Hsiao-Yun; Lin, Han-Wen; Liu, Chien-Min; Chang, Yuan-Wei; Huang, Annie T.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering |
