1. You are Here：

Browsing by Author Huang, Yen-Jun

Jump to: 0-9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
or enter first few letters:  
Showing results 1 to 6 of 6
Issue DateTitleAuthor(s)
Jul-2016Adhesion Property Between Cu, Ti Metal and SU-8, AZ 4620 Polymer DielectricHuang, Yen-Jun; Hsieh, Yen-Hui; Shih, Jian-Yu; Chen, Han-Chun; Leu, Jihperng; Chen, Kuan-Neng; 材料科學與工程學系; 電子物理學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electrophysics; Department of Electronics Engineering and Institute of Electronics
1-Jan-2017Asymmetry Hybrid Bonding Using Cu/Sn Bonding with Polyimide for 3D Heterogeneous Integration ApplicationsHuang, Yen-Jun; Chen, Hsiu-Chi; Yu, Ting-Yang; Lai, Bo-Hung; Shih, Yu-Chiao; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jan-2017Development and Investigation of Ultra-Thin Buffer Layers Used in Symmetric Cu/Sn Bonding and Asymmetric Cu/Sn-Cu Bonding for Advanced 3D Integration ApplicationsChen, Hsiu-Chi; Kho, Yi-Tung; Huang, Yen-Jun; Hsieh, Yu-Sheng; Chang, Yao-Jen; Tang, Ya-Sheng; Yu, Ting-Yang; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Feb-2018Exploring the Correspondence Between Chemical States and Adhesion Property for Cr, Co Metal/AZ 4620, BCB Polymer InterfaceHsieh, Yen-Hui; Huang, Yen-Jun; Shih, Jian-Yu; Leu, Jihperng; Chen, Kuan-Neng; 材料科學與工程學系; 電子物理學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electrophysics; Department of Electronics Engineering and Institute of Electronics
1-Jan-2017Polymer for Wafer-level Hybrid Bonding and Its Adhesion to Passivation Layer in 3D IntegrationLu, Cheng-Hsien; Kho, Yi-Tung; Cheng, Chuan-An; Huang, Yen-Jun; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2017三維積體電路異質整合之聚醯亞胺材料應用於銅/錫與銅/銅非對稱混合接合研究黃諺鈞; 陳冠能; Huang, Yen-Jun; Chen, Kuan-Neng; 電子研究所
Showing results 1 to 6 of 6