標題: Exploring the Correspondence Between Chemical States and Adhesion Property for Cr, Co Metal/AZ 4620, BCB Polymer Interface
作者: Hsieh, Yen-Hui
Huang, Yen-Jun
Shih, Jian-Yu
Leu, Jihperng
Chen, Kuan-Neng
材料科學與工程學系
電子物理學系
電子工程學系及電子研究所
Department of Materials Science and Engineering
Department of Electrophysics
Department of Electronics Engineering and Institute of Electronics
關鍵字: Adhesion;heterogeneous integration;metal;polymer
公開日期: 1-二月-2018
摘要: A method is built for describing the relationship between adhesion strength and chemical states of Co/polymer and Cr/polymer interfaces. Based on the chemical bonding model, the adhesion strength is confirmed to be dominated by the metal organic complex at the interfaces. For Cr/polymers interfaces, the formation of metal-organic complex is restricted by the oxidation of metal atoms during deposition, which leads to almost no variation in adhesion from low [benzocyclobutene(BCB)] to high (AZ 4620) oxygenated polymers. On the other hand, a strong adhesion is observed at the Co/BCB interface that arises from the metal-organic bonds associated with hydroxyl groups in the polymer. The method is expected to provide clear analysis to other metal-polymer interfaces for seeking proper combination in heterogeneous integration.
URI: http://dx.doi.org/10.1109/TCPMT.2017.2786031
http://hdl.handle.net/11536/144489
ISSN: 2156-3950
DOI: 10.1109/TCPMT.2017.2786031
期刊: IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
Volume: 8
起始頁: 195
結束頁: 201
顯示於類別:期刊論文