標題: | Exploring the Correspondence Between Chemical States and Adhesion Property for Cr, Co Metal/AZ 4620, BCB Polymer Interface |
作者: | Hsieh, Yen-Hui Huang, Yen-Jun Shih, Jian-Yu Leu, Jihperng Chen, Kuan-Neng 材料科學與工程學系 電子物理學系 電子工程學系及電子研究所 Department of Materials Science and Engineering Department of Electrophysics Department of Electronics Engineering and Institute of Electronics |
關鍵字: | Adhesion;heterogeneous integration;metal;polymer |
公開日期: | 1-二月-2018 |
摘要: | A method is built for describing the relationship between adhesion strength and chemical states of Co/polymer and Cr/polymer interfaces. Based on the chemical bonding model, the adhesion strength is confirmed to be dominated by the metal organic complex at the interfaces. For Cr/polymers interfaces, the formation of metal-organic complex is restricted by the oxidation of metal atoms during deposition, which leads to almost no variation in adhesion from low [benzocyclobutene(BCB)] to high (AZ 4620) oxygenated polymers. On the other hand, a strong adhesion is observed at the Co/BCB interface that arises from the metal-organic bonds associated with hydroxyl groups in the polymer. The method is expected to provide clear analysis to other metal-polymer interfaces for seeking proper combination in heterogeneous integration. |
URI: | http://dx.doi.org/10.1109/TCPMT.2017.2786031 http://hdl.handle.net/11536/144489 |
ISSN: | 2156-3950 |
DOI: | 10.1109/TCPMT.2017.2786031 |
期刊: | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY |
Volume: | 8 |
起始頁: | 195 |
結束頁: | 201 |
顯示於類別: | 期刊論文 |