完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Hsieh, Yen-Hui | en_US |
dc.contributor.author | Huang, Yen-Jun | en_US |
dc.contributor.author | Shih, Jian-Yu | en_US |
dc.contributor.author | Leu, Jihperng | en_US |
dc.contributor.author | Chen, Kuan-Neng | en_US |
dc.date.accessioned | 2018-08-21T05:53:17Z | - |
dc.date.available | 2018-08-21T05:53:17Z | - |
dc.date.issued | 2018-02-01 | en_US |
dc.identifier.issn | 2156-3950 | en_US |
dc.identifier.uri | http://dx.doi.org/10.1109/TCPMT.2017.2786031 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/144489 | - |
dc.description.abstract | A method is built for describing the relationship between adhesion strength and chemical states of Co/polymer and Cr/polymer interfaces. Based on the chemical bonding model, the adhesion strength is confirmed to be dominated by the metal organic complex at the interfaces. For Cr/polymers interfaces, the formation of metal-organic complex is restricted by the oxidation of metal atoms during deposition, which leads to almost no variation in adhesion from low [benzocyclobutene(BCB)] to high (AZ 4620) oxygenated polymers. On the other hand, a strong adhesion is observed at the Co/BCB interface that arises from the metal-organic bonds associated with hydroxyl groups in the polymer. The method is expected to provide clear analysis to other metal-polymer interfaces for seeking proper combination in heterogeneous integration. | en_US |
dc.language.iso | en_US | en_US |
dc.subject | Adhesion | en_US |
dc.subject | heterogeneous integration | en_US |
dc.subject | metal | en_US |
dc.subject | polymer | en_US |
dc.title | Exploring the Correspondence Between Chemical States and Adhesion Property for Cr, Co Metal/AZ 4620, BCB Polymer Interface | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1109/TCPMT.2017.2786031 | en_US |
dc.identifier.journal | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | en_US |
dc.citation.volume | 8 | en_US |
dc.citation.spage | 195 | en_US |
dc.citation.epage | 201 | en_US |
dc.contributor.department | 材料科學與工程學系 | zh_TW |
dc.contributor.department | 電子物理學系 | zh_TW |
dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
dc.contributor.department | Department of Materials Science and Engineering | en_US |
dc.contributor.department | Department of Electrophysics | en_US |
dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
dc.identifier.wosnumber | WOS:000424515100004 | en_US |
顯示於類別: | 期刊論文 |