標題: Adhesion Investigation Between Metal and Benzocyclobutene (BCB) Polymer Dielectric Materials in 3-D Integration Applications
作者: Shih, Jian-Yu
Huang, Wen-Chun
Ko, Cheng-Ta
Yang, Zheng
Hu, Sheng-Hsiang
Leu, Jihperng
Chou, Keng C.
Chen, Kuan-Neng
交大名義發表
材料科學與工程學系
電子工程學系及電子研究所
National Chiao Tung University
Department of Materials Science and Engineering
Department of Electronics Engineering and Institute of Electronics
關鍵字: Adhesion;benzocyclobutene (BCB);3-D integration
公開日期: 1-九月-2014
摘要: In this paper, the interfacial adhesion strength between metal layer and benzocyclobutene (BCB) polymer dielectric in 3-D integration applications is investigated. The effects of layer thickness, layer stacking order, and additional adhesion layer of titanium (Ti) layer between copper (Cu) and BCB polymer are investigated. Surprisingly, the conventional titanium adhesion layer commonly used in the semiconductor industry weakens the interfacial adhesion strength between copper and BCB. Additionally, to figure out the interfacial adhesion mechanisms, the interfacial structures probed by sum-frequency-generation vibrational spectroscopy are correlated to the adhesion strengths measured from corresponding sample interfaces. It is found that ordered C-H groups at the metal/BCB interface, such as titanium/BCB or molybdenum/BCB, lead to weak interfacial adhesion strength, whereas disordered interfaces, i.e., copper/BCB, lead to strong interfacial adhesion strength.
URI: http://dx.doi.org/10.1109/TDMR.2014.2343793
http://hdl.handle.net/11536/25196
ISSN: 1530-4388
DOI: 10.1109/TDMR.2014.2343793
期刊: IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY
Volume: 14
Issue: 3
起始頁: 914
結束頁: 920
顯示於類別:期刊論文


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