Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Chin Albert | en_US |
| dc.contributor.author | Cheng Chun-Hu | en_US |
| dc.date.accessioned | 2014-12-16T06:14:59Z | - |
| dc.date.available | 2014-12-16T06:14:59Z | - |
| dc.date.issued | 2013-05-23 | en_US |
| dc.identifier.govdoc | H01L045/00 | zh_TW |
| dc.identifier.govdoc | H01L021/8239 | zh_TW |
| dc.identifier.govdoc | B82Y099/00 | zh_TW |
| dc.identifier.govdoc | B82Y030/00 | zh_TW |
| dc.identifier.uri | http://hdl.handle.net/11536/105048 | - |
| dc.description.abstract | Resistive random access memory (RRAM) using stacked dielectrics and a method for manufacturing the same are disclosed, where a setting power of only 4 μW, an ultra-low reset power of 2 nW, good switching uniformity and excellent cycling endurance up to 5×109 cycles were achieved simultaneously. Such record high performances were reached in a Ni/GeOx/nano-crystal-TiO2/TaON/TaN RRAM device, where the excellent endurance is 4˜6 orders of magnitude larger than existing Flash memory. The very long endurance and low switching energy RRAM is not only satisfactory for portable SSD in a computer, but may also create new applications such as being used for a Data Center to replace high power consumption hard discs. | zh_TW |
| dc.language.iso | zh_TW | en_US |
| dc.title | RESISTIVE RANDOM ACCESS MEMORY (RRAM) USING STACKED DIELECTRICS AND METHOD FOR MANUFACTURING THE SAME | zh_TW |
| dc.type | Patents | en_US |
| dc.citation.patentcountry | USA | zh_TW |
| dc.citation.patentnumber | 20130126818 | zh_TW |
| Appears in Collections: | Patents | |
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