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dc.contributor.author李承士en_US
dc.contributor.author張翼en_US
dc.date.accessioned2014-12-16T06:17:25Z-
dc.date.available2014-12-16T06:17:25Z-
dc.date.issued2004-10-21en_US
dc.identifier.govdocH01L021/203zh_TW
dc.identifier.govdocH01L021/203zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/106423-
dc.description.abstract本發明砷化鎵元件背面銅金屬化之製作方法,係將砷化鎵元件背面金屬化金屬由金改為銅,由於銅的阻值較低,且散熱與機械強度亦較金優異。因此,以銅作為金屬化金屬之元件,可改善元件的散熱、機械強度、導電度,更可增進元件的特性及可靠度。並藉由鎢(W)、氮化鎢(WN)、氮化鈦鎢(TiWN)等薄膜作為擴散阻障層,有效阻擋銅易擴散入砷化鎵基材而改變元件特性之問題。zh_TW
dc.language.isozh_TWen_US
dc.title砷化鎵元件背面銅金屬化之製作方法zh_TW
dc.typePatentsen_US
dc.citation.patentcountryTWNzh_TW
dc.citation.patentnumberI222675zh_TW
Appears in Collections:Patents


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