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dc.contributor.authorChen, Chen Chiaen_US
dc.contributor.authorSheu, Jeng Tzongen_US
dc.contributor.authorChiang, Sung Linen_US
dc.contributor.authorSheu, Meng Liehen_US
dc.date.accessioned2014-12-08T15:16:29Z-
dc.date.available2014-12-08T15:16:29Z-
dc.date.issued2006-06-01en_US
dc.identifier.issn0021-4922en_US
dc.identifier.urihttp://dx.doi.org/10.1143/JJAP.45.5531en_US
dc.identifier.urihttp://hdl.handle.net/11536/12193-
dc.description.abstractWe demonstrated a sidewall spacer nanofabrication technique for nanogap, electrodes fabrication. Nanogap between gold and polycrystalline silicon (ploy-Si) electrodes is defined without using any advanced lithographic techniques. The feature size of nanogap electrodes fabricated using this technique is mainly determined by the thickness of sidewall spacer. The proposed technique showed that reproducible nanogap distances from 10 to 100 nm on the 6 in. wafer were easily obtained. Binding of 15 nm gold nanoparticles across the 10 nm electrodes leading to a drastic change of the electrical conductance has also been demonstrated. Under a bias of 3 V, the conductive current increases from 2 pA to 300 nA after binding of 15 nm gold nanoparticles across the 10-nm electrodes. We believed that this technique can be contributed to the development of high-density nanogap electrodes for applications in biomolecules or nanoparticles detection.en_US
dc.language.isoen_USen_US
dc.subjectsidewall spaceren_US
dc.subjectnanogap electrodeen_US
dc.subjectgold nanoparticlesen_US
dc.subjectbiomolecule detectionen_US
dc.titleA novel nanofabrication technique for the array of nanogap electrodesen_US
dc.typeArticle; Proceedings Paperen_US
dc.identifier.doi10.1143/JJAP.45.5531en_US
dc.identifier.journalJAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERSen_US
dc.citation.volume45en_US
dc.citation.issue6Ben_US
dc.citation.spage5531en_US
dc.citation.epage5534en_US
dc.contributor.department材料科學與工程學系奈米科技碩博班zh_TW
dc.contributor.departmentGraduate Program of Nanotechnology , Department of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000240882800037-
Appears in Collections:Conferences Paper


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