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dc.contributor.authorHsu, YCen_US
dc.contributor.authorChen, DCen_US
dc.contributor.authorLiu, PCen_US
dc.contributor.authorChen, Cen_US
dc.date.accessioned2014-12-08T15:18:20Z-
dc.date.available2014-12-08T15:18:20Z-
dc.date.issued2005-10-01en_US
dc.identifier.issn0884-2914en_US
dc.identifier.urihttp://dx.doi.org/10.1557/JMR.2005.0350en_US
dc.identifier.urihttp://hdl.handle.net/11536/13223-
dc.description.abstractMeasurement of electromigration parameters in the lead-free solder SnAg3.5 was carried out by utilizing U-groove solder lines and atomic force microscopy in the temperature range of 100-150 degrees C. The drift velocity was measured, and the threshold current densities of the SnAg3.5 solder were estimated to be 4.4 x 10(4) A/cm(2) at 100 degrees C, 3.3 x 10(4) A/cm(2) at 125 degrees C, and 5.7 x 10(3) A/cm(2) at 150 degrees C. These values represent the maximum current densities that the SnAg3.5 solder can carry without electromigration damage at the three stressing temperatures. The critical products for the SnAg3.5 solder were estimated to be 462 A/cm at 100 degrees C, 346 A/cm at 125 degrees C, and 60 A/cm at 150 degrees C. In addition, the electromigration activation energy was determined to be 0.55 eV in the temperature range of 100-150 degrees C. These values are very fundamental for current carrying capability and mean-time-to-failure measurement for solder bumps. This technique enables the direct measurement of electromigration parameters of solder materials.en_US
dc.language.isoen_USen_US
dc.titleMeasurement of electromigration parameters of lead-free SnAg3.5 solder using U-groove linesen_US
dc.typeArticleen_US
dc.identifier.doi10.1557/JMR.2005.0350en_US
dc.identifier.journalJOURNAL OF MATERIALS RESEARCHen_US
dc.citation.volume20en_US
dc.citation.issue10en_US
dc.citation.spage2831en_US
dc.citation.epage2837en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000232459000030-
dc.citation.woscount4-
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