Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 羅志偉 | en_US |
| dc.contributor.author | 曾勝陽 | en_US |
| dc.contributor.author | 曾雅欣 | en_US |
| dc.contributor.author | 朱慧心 | en_US |
| dc.date.accessioned | 2016-12-20T05:04:19Z | - |
| dc.date.available | 2016-12-20T05:04:19Z | - |
| dc.date.issued | 2016-04-01 | en_US |
| dc.identifier.govdoc | B23K026/06 | zh_TW |
| dc.identifier.uri | http://hdl.handle.net/11536/132264 | - |
| dc.description.abstract | 一種雷射加工方法包括以下步驟：提供基板，其中基板具有第一面以及與第一面相對的第二面；以第一雷射光照射第一面，且以第二雷射光照射第二面，其中第一雷射光與第二雷射光的傳遞方向在基板的法線方向上的分量為相反。本發明另提供一種雷射加工物。 | zh_TW |
| dc.language.iso | zh_TW | en_US |
| dc.title | 雷射加工方法及雷射加工物 | zh_TW |
| dc.type | Patents | en_US |
| dc.citation.patentcountry | TWN | zh_TW |
| dc.citation.patentnumber | 201611932 | zh_TW |
| Appears in Collections: | Patents | |
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