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dc.contributor.authorLi, Chun-Hsingen_US
dc.contributor.authorKo, Chun-Linen_US
dc.contributor.authorKuo, Chien-Nanen_US
dc.contributor.authorKuo, Ming-Chingen_US
dc.contributor.authorChang, Da-Chiangen_US
dc.date.accessioned2017-04-21T06:49:15Z-
dc.date.available2017-04-21T06:49:15Z-
dc.date.issued2013en_US
dc.identifier.isbn978-1-4673-2141-9en_US
dc.identifier.isbn978-1-4673-6177-4en_US
dc.identifier.issn0149-645Xen_US
dc.identifier.urihttp://hdl.handle.net/11536/136040-
dc.description.abstractA low-cost broadband interconnect, composed of bondwires and transmission lines, is proposed for heterogeneous system integration. By designing the length and the characteristic impedance of the transmission lines, the bondwire effect can be reduced to provide an interconnect with good return loss and low insertion loss. In this work, the chip and the carrier are realized in 90-nm CMOS and GIPD process, respectively. Measured results show that the return loss and the insertion loss are better than 10 dB and 1.1 dB, respectively, from DC to 45.2 GHz.en_US
dc.language.isoen_USen_US
dc.subjectBroadbanden_US
dc.subjectinterconnecten_US
dc.subjectbondwireen_US
dc.subjecttransmission linesen_US
dc.subjectheterogeneous integrationen_US
dc.titleA Low-Cost Broadband Bondwire Interconnect for Heterogeneous System Integrationen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2013 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST (IMS)en_US
dc.contributor.department電機工程學系zh_TW
dc.contributor.departmentDepartment of Electrical and Computer Engineeringen_US
dc.identifier.wosnumberWOS:000369754300069en_US
dc.citation.woscount0en_US
Appears in Collections:Conferences Paper