標題: | A High Q On-Chip Bondwire Transformer and Its Application to Low Power Receiver Front-End Design |
作者: | Li, Chun-Hsing Kuo, Chien-Nan Kuo, Ming-Ching 電子工程學系及電子研究所 Department of Electronics Engineering and Institute of Electronics |
關鍵字: | Low power;bondwire;transformer;receiver |
公開日期: | 2013 |
摘要: | This work presents a high Q on-chip bondwire transformer and its application to a low power receiver front-end design. The proposed bondwire transformer has the advantage of high quality factor, less sensitivity to the bonding height variation, and working as a balun to conduct single-to-differential conversion. Furthermore, the chip area under the bondwire transformer can be reused by the mixer and buffer circuits to reduce the cost. The receiver front-end is realized in 1P6M 0.18 mu m CMOS technology. The measured input return loss, the conversion gain, the noise figure, and the input third-order intercept point are 12.7 dB, 20.5 dB, 9.8 dB, and -4.0 dBm, respectively, at 2.1 GHz. The power consumption is only 1.1 mW from a 1 V supply. |
URI: | http://hdl.handle.net/11536/21968 |
ISBN: | 978-1-4673-1553-1 |
期刊: | 2013 IEEE 13TH TOPICAL MEETING ON SILICON MONOLITHIC INTEGRATED CIRCUITS IN RF SYSTEMS (SIRF) |
起始頁: | 120 |
結束頁: | 122 |
顯示於類別: | 會議論文 |