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dc.contributor.authorLin, Chih-Haoen_US
dc.contributor.authorWhang, Wha-Tzongen_US
dc.contributor.authorChen, Chun-Huaen_US
dc.contributor.authorHuang, Shu-Chenen_US
dc.contributor.authorChen, Kai-Chien_US
dc.date.accessioned2020-05-05T00:02:23Z-
dc.date.available2020-05-05T00:02:23Z-
dc.date.issued2020-01-01en_US
dc.identifier.urihttp://dx.doi.org/10.3390/polym12010021en_US
dc.identifier.urihttp://hdl.handle.net/11536/154188-
dc.description.abstractThis study investigated a new category of transparent encapsulant materials for light-emitting diodes (LEDs). It comprised a phenyl group that contained siloxane-modified epoxy (SEP-Ph) hybridized with a cyclic tetrafunctional siloxane-modified epoxy (SEP-D4) with methylhexahydrophthalic anhydride (MHHPA) as a curing agent. The SEP-Ph/SEP-D4 = 0.5/0.5 (sample 3) and SEP-D4 (sample 4) could provide notably high optical transmittance (over 90% in the visible region), high-temperature discoloration resistance, low stress, and more crucially, noteworthy sulfurization resistance. The lumen flux retention of the SEP encapsulated surface mounted device LEDs remained between approximately 97% and 99% after a sulfurization test for 240 h. The obtained comprehensive optical, mechanical, and sulfurization resistance proved the validity and uniqueness of the present design concept with complementary physical and chemical characteristics.en_US
dc.language.isoen_USen_US
dc.subjectsiloxane-modified epoxyen_US
dc.subjectcrosslinking densityen_US
dc.subjectsulfurization resistanceen_US
dc.subjectsurface mounted device LEDsen_US
dc.subjectencapsulanten_US
dc.titleNovel Siloxane-Modified Epoxy Resins as Promising Encapsulant for LEDsen_US
dc.typeArticleen_US
dc.identifier.doi10.3390/polym12010021en_US
dc.identifier.journalPOLYMERSen_US
dc.citation.volume12en_US
dc.citation.issue1en_US
dc.citation.spage0en_US
dc.citation.epage0en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000519848300021en_US
dc.citation.woscount0en_US
Appears in Collections:Articles