標題: | Direct encapsulation of organic light-emitting devices (OLEDs) using photo-curable co-polyacrylate/silica nanocomposite resin |
作者: | Wang, Yu-Young Hsieh, Tsung-Eong Chen, I-Ching Chen, Chin-Hsin 材料科學與工程學系 應用化學系 顯示科技研究所 Department of Materials Science and Engineering Department of Applied Chemistry Institute of Display |
關鍵字: | direct encapsulation;organic light-emitting devices (OLEDs);photo-curable nanocomposite resin |
公開日期: | 1-八月-2007 |
摘要: | Direct encapsulation of organic light-emitting devices (OLEDs) was realized by using highly transparent, photo-curable co-polyacrylate/silica nanocomposite resin. Feasibility of such a resin for OLED encapsulation was evaluated by physical/electrical property analysis of resins and driving voltage/luminance/lifetime measurement of OLEDs. Electrical property analysis revealed a higher electrical insulation of photocured nanocomposite resin film at 3.20 x 1012 9 in comparison with that of oligomer film at 1.18 x 10(12) Omega at 6.15 V to drive the bare OLED. This resulted a lower leakage current and the device driving voltage was efficiently reduced so that the nanocomposite-encapsulated OLED could be driven at a lower driving voltage of 6.09 V rather than 6.77 V for the oligomer-encapsulated OLED at the current density of 20 mA/cm(2). Luminance measurement revealed a less than 1.0% luminance difference of OLEDs encapsulated by various types of resins, which indicates that the photo-polymerization takes very little effect on the light-emitting property of OLEDs. Lifetime measurement of OLEDs found that t(80), the time span for the normalized luminance of device drops to 80%, for nanocomposite-encapsulated OLED is 350.17 h in contrast to 16.83 h for bare OLED and 178.17 h for the oligomer-encapsulated OLED. This demonstrates that nanocomposite resin with optimum properties is feasible to OLED packaging and a compact device structure could be achieved via the method of direct encapsulation. |
URI: | http://dx.doi.org/10.1109/TADVP.2006.890150 http://hdl.handle.net/11536/10487 |
ISSN: | 1521-3323 |
DOI: | 10.1109/TADVP.2006.890150 |
期刊: | IEEE TRANSACTIONS ON ADVANCED PACKAGING |
Volume: | 30 |
Issue: | 3 |
起始頁: | 421 |
結束頁: | 427 |
顯示於類別: | 期刊論文 |