標題: Direct encapsulation of organic light-emitting devices (OLEDs) using photo-curable co-polyacrylate/silica nanocomposite resin
作者: Wang, Yu-Young
Hsieh, Tsung-Eong
Chen, I-Ching
Chen, Chin-Hsin
材料科學與工程學系
應用化學系
顯示科技研究所
Department of Materials Science and Engineering
Department of Applied Chemistry
Institute of Display
關鍵字: direct encapsulation;organic light-emitting devices (OLEDs);photo-curable nanocomposite resin
公開日期: 1-Aug-2007
摘要: Direct encapsulation of organic light-emitting devices (OLEDs) was realized by using highly transparent, photo-curable co-polyacrylate/silica nanocomposite resin. Feasibility of such a resin for OLED encapsulation was evaluated by physical/electrical property analysis of resins and driving voltage/luminance/lifetime measurement of OLEDs. Electrical property analysis revealed a higher electrical insulation of photocured nanocomposite resin film at 3.20 x 1012 9 in comparison with that of oligomer film at 1.18 x 10(12) Omega at 6.15 V to drive the bare OLED. This resulted a lower leakage current and the device driving voltage was efficiently reduced so that the nanocomposite-encapsulated OLED could be driven at a lower driving voltage of 6.09 V rather than 6.77 V for the oligomer-encapsulated OLED at the current density of 20 mA/cm(2). Luminance measurement revealed a less than 1.0% luminance difference of OLEDs encapsulated by various types of resins, which indicates that the photo-polymerization takes very little effect on the light-emitting property of OLEDs. Lifetime measurement of OLEDs found that t(80), the time span for the normalized luminance of device drops to 80%, for nanocomposite-encapsulated OLED is 350.17 h in contrast to 16.83 h for bare OLED and 178.17 h for the oligomer-encapsulated OLED. This demonstrates that nanocomposite resin with optimum properties is feasible to OLED packaging and a compact device structure could be achieved via the method of direct encapsulation.
URI: http://dx.doi.org/10.1109/TADVP.2006.890150
http://hdl.handle.net/11536/10487
ISSN: 1521-3323
DOI: 10.1109/TADVP.2006.890150
期刊: IEEE TRANSACTIONS ON ADVANCED PACKAGING
Volume: 30
Issue: 3
起始頁: 421
結束頁: 427
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