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dc.contributor.authorChung, SHen_US
dc.contributor.authorHsieh, MHen_US
dc.contributor.authorLiu, JCen_US
dc.date.accessioned2014-12-08T15:25:48Z-
dc.date.available2014-12-08T15:25:48Z-
dc.date.issued2004en_US
dc.identifier.isbn0-7803-8469-5en_US
dc.identifier.urihttp://hdl.handle.net/11536/18230-
dc.identifier.urihttp://dx.doi.org/10.1109/ISAPM.2004.1287988en_US
dc.description.abstractWafer manufacturers usually face critical problems when making decisions regarding to the tool portfolio elimination, mainly due to the dramatic and frequent influences from their internal and external environments. This paper is aimed to develop a mechanism, named Tool Portfolio Elimination Mechanism (TPEM), to evaluate the impacts on production performance and capital expenditure, and to determine which equipment is suitable for pruning. In TPEM, there are four stages to decide tool portfolio elimination according to the PDCA cycle. Meanwhile, the simulation results show; that the fab production performance and cost are much improved by the TPEM algorithm. Especially, it can be applied and implemented to industry very quickly and easily.en_US
dc.language.isoen_USen_US
dc.titleA tool portfolio elimination mechanism (TPEM) for a wafer faben_US
dc.typeProceedings Paperen_US
dc.identifier.doi10.1109/ISAPM.2004.1287988en_US
dc.identifier.journal2004 SEMICONDUCTOR MANUFACTURING TECHNOLOGY WORKSHOP PROCEEDINGSen_US
dc.citation.spage51en_US
dc.citation.epage53en_US
dc.contributor.department工業工程與管理學系zh_TW
dc.contributor.departmentDepartment of Industrial Engineering and Managementen_US
dc.identifier.wosnumberWOS:000225401500012-
Appears in Collections:Conferences Paper


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