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dc.contributor.authorKer, MDen_US
dc.contributor.authorTseng, TKen_US
dc.contributor.authorYang, SCen_US
dc.contributor.authorShih, Aen_US
dc.contributor.authorTsai, YMen_US
dc.date.accessioned2014-12-08T15:26:21Z-
dc.date.available2014-12-08T15:26:21Z-
dc.date.issued2003en_US
dc.identifier.isbn0-7803-7765-6en_US
dc.identifier.urihttp://hdl.handle.net/11536/18712-
dc.description.abstractESD robustness of Low Temperature Poly-Si (LTPS) diodes and TFT devices has been investigated in this paper. By using the Transmission Line Pulsing (TLP) techniques, the It2 (secondary breakdown current) of LTPS diodes and TFT devices were measured. To evaluate the ESD robustness of components for ESD protection, the shifts of breakdown voltage and cut-in voltage of LTPS diode and TFT devices after TLP stress are considered into failure threshold judgment. From the experimental results, It2 of LTPS diodes under forward-biased stress is better than that of LTPS TFT devices. Furthermore, the It2 of LTPS TFT devices under reverse-biased stress is more robust than it under forward-biased stress. Such investigation results can help us to design a successful ESD protection for the circuits on glass.en_US
dc.language.isoen_USen_US
dc.titleEvaluation on ESD robustness of UPS diode and TFT device by transmission line pulsing (TLP) techniqueen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2003 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS, AND APPLICATIONS, PROCEEDINGS OF TECHNICAL PAPERSen_US
dc.citation.spage88en_US
dc.citation.epage91en_US
dc.contributor.department電機學院zh_TW
dc.contributor.departmentCollege of Electrical and Computer Engineeringen_US
dc.identifier.wosnumberWOS:000189391000024-
Appears in Collections:Conferences Paper