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dc.contributor.authorFatah, Faizen_US
dc.contributor.authorKuo, Chien-Ien_US
dc.contributor.authorHsu, Heng-Tungen_US
dc.contributor.authorChiang, Che-Yangen_US
dc.contributor.authorHsu, Ching-Yien_US
dc.contributor.authorMiyamoto, Yasuyukien_US
dc.contributor.authorChang, Edward Yien_US
dc.date.accessioned2014-12-08T15:28:33Z-
dc.date.available2014-12-08T15:28:33Z-
dc.date.issued2012-11-01en_US
dc.identifier.issn0021-4922en_US
dc.identifier.urihttp://dx.doi.org/10.1143/JJAP.51.110203en_US
dc.identifier.urihttp://hdl.handle.net/11536/20646-
dc.description.abstractIn this paper, we present the fabrication and characterization of 40 nm InAs-channel high-electron-mobility-transistor (HEMT) devices. Both DC and RF measurements were performed under various bias conditions. We have also extracted bias-dependent intrinsic device parameters to determine the optimum conditions of operation. It is concluded that a high current-gain cutoff frequency (f(T)) of 615 GHz can be achieved when the device is biased near the occurrence of impact ionization. (C) 2012 The Japan Society of Applied Physicsen_US
dc.language.isoen_USen_US
dc.titleBias-Dependent Radio Frequency Performance for 40nm InAs High-Electron-Mobility Transistor with a Cutoff Frequency Higher than 600GHzen_US
dc.typeArticleen_US
dc.identifier.doi10.1143/JJAP.51.110203en_US
dc.identifier.journalJAPANESE JOURNAL OF APPLIED PHYSICSen_US
dc.citation.volume51en_US
dc.citation.issue11en_US
dc.citation.epageen_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000310709500003-
dc.citation.woscount0-
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