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dc.contributor.authorKer, Ming-Douen_US
dc.contributor.authorLin, Chun-Yuen_US
dc.date.accessioned2014-12-08T15:43:37Z-
dc.date.available2014-12-08T15:43:37Z-
dc.date.issued2008-05-01en_US
dc.identifier.issn0018-9480en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TMTT.2008.920176en_US
dc.identifier.urihttp://hdl.handle.net/11536/29497-
dc.description.abstractThe silicon-controlled rectifier (SCR) has been used as an effective on-chip electrostatic discharge (ESD) protection device in CMOS technology due to the highest ESD robustness in nanoscale integrated circuits (10). In this study, the SCR realized in a waffle layout structure is proposed to improve ESD current distribution efficiency for ESD protection and to reduce the parasitic capacitance. The waffle layout structure of the SCR can achieve smaller parasitic capacitance under the same ESD robustness. With smaller parasitic capacitance, the degradation on RF circuit performance due to ESD protection devices can be reduced. The proposed waffle SCR with low parasitic capacitance is suitable for on-chip ESD protection in RF ICs. Besides, the desired current to trigger on the SCR device with a waffle layout structure and its turn-on time has also been investigated in a silicon chip.en_US
dc.language.isoen_USen_US
dc.subjectelectrostatic discharge (ESD)en_US
dc.subjectRF integrated circuit (RF IC)en_US
dc.subjectsilicon-controlled rectifier (SCR)en_US
dc.titleLow-capacitance SCR with waffle layout structure for on-chip ESD protection in RF ICsen_US
dc.typeArticle; Proceedings Paperen_US
dc.identifier.doi10.1109/TMTT.2008.920176en_US
dc.identifier.journalIEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUESen_US
dc.citation.volume56en_US
dc.citation.issue5en_US
dc.citation.spage1286en_US
dc.citation.epage1294en_US
dc.contributor.department電機學院zh_TW
dc.contributor.departmentCollege of Electrical and Computer Engineeringen_US
dc.identifier.wosnumberWOS:000256024500009-
Appears in Collections:Conferences Paper


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