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dc.contributor.author蘇啟孟en_US
dc.contributor.authorSu, Qi-Mengen_US
dc.contributor.author李崇仁en_US
dc.contributor.author任建葳en_US
dc.contributor.authorLi, Chong-Renen_US
dc.contributor.authorRen, Jian-Weien_US
dc.date.accessioned2014-12-12T02:02:39Z-
dc.date.available2014-12-12T02:02:39Z-
dc.date.issued1982en_US
dc.identifier.urihttp://140.113.39.130/cdrfb3/record/nctu/#NT714428012en_US
dc.identifier.urihttp://hdl.handle.net/11536/51732-
dc.description.abstract本文發展出利用橢圓儀與光儀測量複晶矽厚度的技術。對橢圓儀測量技術而言,利用 實驗得到的折射率,藉著計算機可以快地求出複晶矽的厚度與吸收係數。光譜儀測量 技術包括,Curve fi-tting與Extrena 兩種方法。四百埃以下的複晶矽,採用Curve fitting 法,其他的厚度,兩種方法都適用,可用以互相比較。zh_TW
dc.language.isozh_TWen_US
dc.subject橢圓儀zh_TW
dc.subject光譜儀zh_TW
dc.subject複晶矽zh_TW
dc.subject厚度測量zh_TW
dc.subject折射率zh_TW
dc.subject吸收係數zh_TW
dc.subject電子工程zh_TW
dc.subjectCURVE-FITTINGen_US
dc.subjectEXTREMAen_US
dc.subjectELECTRONIC-ENGINEERINGen_US
dc.title橢圓儀與光譜儀在複晶矽厚度測量上之應用zh_TW
dc.typeThesisen_US
dc.contributor.department電子研究所zh_TW
Appears in Collections:Thesis