高密度電子構裝接合與測試載具之開發---子計畫II：銅接合可靠度提升之研究(III)

Full metadata record

DC Field	Value	Language
dc.contributor.author	邱碧秀	en_US
dc.contributor.author	CHIOU BI-SHIOU	en_US
dc.date.accessioned	2014-12-13T10:37:00Z	-
dc.date.available	2014-12-13T10:37:00Z	-
dc.date.issued	1999	en_US
dc.identifier.govdoc	NSC88-2216-E009-012	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/94335	-
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=418199&docId=74188	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.language.iso	zh_TW	en_US
dc.subject	銅金屬化	zh_TW
dc.subject	擴散阻礙層	zh_TW
dc.subject	電子構裝	zh_TW
dc.subject	電致遷移	zh_TW
dc.subject	應力遷移	zh_TW
dc.subject	Cu metallization	en_US
dc.subject	Diffusion barrier layer	en_US
dc.subject	Electronic packaging	en_US
dc.subject	Electromigration	en_US
dc.subject	Stress migration	en_US
dc.title	高密度電子構裝接合與測試載具之開發---子計畫II：銅接合可靠度提升之研究(III)	zh_TW
dc.title	Enhanced Cu Interconnection Reliability (III)	en_US
dc.type	Plan	en_US
dc.contributor.department	交通大學電子工程系	zh_TW
Appears in Collections:	Research Plans