Characterization of the low temperature activated P+/N junction formed by implant into silicide method

dc.citation.epage641en_US
dc.citation.spage640en_US
dc.contributor.authorChang, Kow-Mingen_US
dc.contributor.authorLin, Jian-Hongen_US
dc.contributor.authorYang, Chih-Hsiangen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.date.accessioned2014-12-08T15:16:18Z
dc.date.available2014-12-08T15:16:18Z
dc.date.issued2007en_US
dc.identifier.isbn978-1-4244-1891-6en_US
dc.identifier.journal2007 INTERNATIONAL SEMICONDUCTOR DEVICE RESEARCH SYMPOSIUM, VOLS 1 AND 2en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/12078
dc.identifier.wosnumberWOS:000255857100330
dc.language.isoen_USen_US
dc.titleCharacterization of the low temperature activated P+/N junction formed by implant into silicide methoden_US
dc.typeProceedings Paperen_US

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