Low temperature polyimide-to-polyimide direct bonding
Loading...
Date
Authors
Journal Title
Journal ISSN
Volume Title
Publisher
DOI
Abstract
In this study, two polyimide (PI) films were bonded at 250/300 degrees C for 60 min. A good bonding interface with few voids was observed. During the bonding process, the partial cured PI film still underwent cross-linking reaction, resulting the voids in bonding sample..