Investigation of high-power device and process for field emission display

dc.citation.epage630en_US
dc.citation.spage628en_US
dc.contributor.authorYeh, CFen_US
dc.contributor.authorLiu, JSen_US
dc.contributor.authorHuang, CMen_US
dc.contributor.department交大名義發表zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentNational Chiao Tung Universityen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.date.accessioned2014-12-08T15:27:39Z
dc.date.available2014-12-08T15:27:39Z
dc.date.issued1996en_US
dc.description.abstractA method of fabricating a semiconductor device including a high withstanding voltage lateral CMOS and a standard logic CMOS is developed for field emission display. Structure, process and simulation by TSUPREM and MEDICI will be discussed in this paper.en_US
dc.identifier.isbn0-7803-3594-5en_US
dc.identifier.journalIVMC '96 - 9TH INTERNATIONAL VACUUM MICROELECTRONICS CONFERENCE, TECHNICAL DIGESTen_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/19906
dc.identifier.wosnumberWOS:A1996BJ05U00142
dc.language.isoen_USen_US
dc.titleInvestigation of high-power device and process for field emission displayen_US
dc.typeProceedings Paperen_US

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