Nondestructive Optical Inspection System for the Dicing Street Quality of Copper/Low-k Wafer

Abstract

To resolve the issue in detecting sidewall crack defect mode in the die singulation of copper/low-k wafer after laser pre-groove/cleaning process, we combine a dedicated optical system with automatic optical inspection system in the production line for the nondestructive wafer-by-wafer optical inspection system to inspect the dicing street quality of copper/low-k wafer. Experiment shows that the sidewall crack defect can be clearly identified with the proposed inspection system and it is potentially applicable for the production line.