以時域有限差分法分析多層印刷電路板的Ground Bounce問題與去耦合電容的有效性

dc.contributor.author	吳霖？	en_US
dc.contributor.author	WU LIN-KUN	en_US
dc.contributor.department	交通大學電信工程系	zh_TW
dc.date.accessioned	2014-12-13T10:37:11Z
dc.date.available	2014-12-13T10:37:11Z
dc.date.issued	1999	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.identifier.govdoc	NSC88-2213-E009-100	zh_TW
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=444356&docId=80478	en_US
dc.identifier.uri	https://ir.lib.nycu.edu.tw/handle/11536/94451
dc.language.iso	zh_TW	en_US
dc.subject	時域有限差分法	zh_TW
dc.subject	多層印刷電路板	zh_TW
dc.subject	高速數位元件	zh_TW
dc.subject	板間電容	zh_TW
dc.subject	去耦合電容	zh_TW
dc.subject	FDTD	en_US
dc.subject	Multi-layer PCB	en_US
dc.subject	High-speed digital device	en_US
dc.subject	Board capacitor	en_US
dc.subject	Decoupling capacitor	en_US
dc.title	以時域有限差分法分析多層印刷電路板的Ground Bounce問題與去耦合電容的有效性	zh_TW
dc.title	FDTD Analysis of Ground Bounce Issue and Effectiveness of Decoupling Capacitors in Multilayer PCBs	en_US
dc.type	Plan	en_US

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