Heterostructure containing IC and LED and method for fabricating the same
| dc.citation.patentcountry | USA | zh_TW |
| dc.citation.patentnumber | 08679891 | zh_TW |
| dc.contributor.author | Chen Kuan-Neng | en_US |
| dc.contributor.author | Ko Cheng-Ta | en_US |
| dc.contributor.author | Lo Wei-Chung | en_US |
| dc.date.accessioned | 2014-12-16T06:13:53Z | |
| dc.date.available | 2014-12-16T06:13:53Z | |
| dc.date.issued | 2014-03-25 | en_US |
| dc.description.abstract | A heterostructure containing IC and LED and a method of fabricating. An IC and an LED are established with the IC having a first electric-conduction block and a first connection block. The IC electrically connects to the first electric-conduction block. A first face of the LED has a second electric-conduction block and a second connection block. The LED is electrically connected to the second electric-conduction block. The first electric-conduction block and the first connection block are respectively joined to the second electric-conduction block and the second connection block, and the first electric-conduction block are electrically connected with the second electric-conduction block to form a heterostructure. The heterostructure provides functions of heat radiation and electric communication for IC and LED. | zh_TW |
| dc.identifier.govdoc | H01L033/62 | zh_TW |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/104400 | |
| dc.language.iso | zh_TW | en_US |
| dc.title | Heterostructure containing IC and LED and method for fabricating the same | zh_TW |
| dc.type | Patents | en_US |