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Home
學術出版;;Publications
研究計畫;;Research Plans
高性能混和訊號式介面積體電路---子計劃III:5 GHz高性能無線通訊系統中主要積體電路的設計與整合(I)
高性能混和訊號式介面積體電路---子計劃III:5 GHz高性能無線通訊系統中主要積體電路的設計與整合(I)
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912215E009080.pdf
(240.57 KB)
Date
2002
Authors
吳重雨
CHUNG-YUWU
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https://www.grb.gov.tw/search/planDetail?id=784532&docId=150805
https://ir.lib.nycu.edu.tw/handle/11536/92887
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