介電層之化學機械拋光漿料與製程設計---子計畫III：積體電路製程中介電層薄膜之材料特性與化學機械拋光之研究

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882216E006046.pdf (515.55 KB)

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1999

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化學機械拋光法, 介電質內薄膜, 極大型積體電路, Chemical-mechanical polishing (CMP), Intern layer dielectrics (ILD), Ultra large scaling integration (ULSI)

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https://www.grb.gov.tw/search/planDetail?id=418291&docId=74210
 https://ir.lib.nycu.edu.tw/handle/11536/94342

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研究計畫;;Research Plans

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