系統晶片之硬體-軟體共同設計(II)

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dc.contributor.author任建葳en_US
dc.contributor.department交通大學電子工程研究所zh_TW
dc.date.accessioned2014-12-13T10:37:17Z
dc.date.available2014-12-13T10:37:17Z
dc.date.issued1999en_US
dc.description.sponsorship行政院國家科學委員會zh_TW
dc.identifier.govdocNSC88-2218-E009-054zh_TW
dc.identifier.urihttps://www.grb.gov.tw/search/planDetail?id=417358&docId=73994en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/94516
dc.language.isozh_TWen_US
dc.subject系統晶片zh_TW
dc.subject硬體軟體共同設計zh_TW
dc.subject系統設計zh_TW
dc.subject視訊信號處理zh_TW
dc.subjectSystem-on-a-chip (SOAC)en_US
dc.subjectHardware-software codesignen_US
dc.subjectSystem designen_US
dc.subjectVideo signal processingen_US
dc.title系統晶片之硬體-軟體共同設計(II)zh_TW
dc.titleThe Hardware-Software Codesign for System-on-a-Chip (II)en_US
dc.typePlanen_US

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