高密度多層構裝基板與接合材料研究---總計畫(III)

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902216E009031.pdf (281.81 KB)
 902216E009031.pdf (281.81 KB)

Date

2001

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高密度, 多層基板, 內接合材料, High density, Multilayer substrate, Interconection material

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https://www.grb.gov.tw/search/planDetail?id=673257&docId=128264
 https://ir.lib.nycu.edu.tw/handle/11536/96608

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研究計畫;;Research Plans

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